参数资料
型号: ISL6322IRZ
厂商: Intersil
文件页数: 31/41页
文件大小: 0K
描述: IC CTRLR PWM 4PHASE BUCK 48-QFN
标准包装: 43
应用: 控制器,Intel VR10、VR11、AMD CPU
输入电压: 5 V ~ 12 V
输出数: 1
输出电压: 0.38 V ~ 1.99 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-VFQFN 裸露焊盘
供应商设备封装: 48-QFN(7x7)
包装: 管件
ISL6322
TABLE 9. REGISTER RGS2 (ADAPTIVE DEADTIME CONTROL/OVERVOLTAGE PROTECTION/SWITCHING FREQUENCY)
BIT7
X
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
BIT6
X
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
BIT5
DT1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
BIT4
DT0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
BIT3
OVP
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
BIT2
FS2
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
BIT1
FS1
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
BIT0
FS0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
ADAPTIVE DEADTIME
CONTROL
PHASE DETECT
PHASE DETECT
PHASE DETECT
PHASE DETECT
PHASE DETECT
PHASE DETECT
PHASE DETECT
PHASE DETECT
PHASE DETECT
PHASE DETECT
LGATE DETECT
LGATE DETECT
LGATE DETECT
LGATE DETECT
LGATE DETECT
LGATE DETECT
LGATE DETECT
LGATE DETECT
LGATE DETECT
LGATE DETECT
OVERVOLTAGE
PROTECTION LEVEL
DEFAULT
DEFAULT
DEFAULT
DEFAULT
DEFAULT
ALTERNATE
ALTERNATE
ALTERNATE
ALTERNATE
ALTERNATE
DEFAULT
DEFAULT
DEFAULT
DEFAULT
DEFAULT
ALTERNATE
ALTERNATE
ALTERNATE
ALTERNATE
ALTERNATE
SWITCHING
FREQUENCY
NOMINAL
-15%
-30%
+15%
+30%
NOMINAL
-15%
-30%
+15%
+30%
NOMINAL
-15%
-30%
+15%
+30%
NOMINAL
-15%
-30%
+15%
+30%
NOTE: It is recommended that frequency shifts occur in 15% increments only.
General Design Guide
This section is intended to provide a high-level explanation of
the steps necessary to create a multiphase power converter. It
is assumed that the reader is familiar with many of the basic
skills and techniques referenced below. In addition to this guide,
Intersil provides complete reference designs that include
schematics, bills of materials, and example board layouts for all
common microprocessor applications.
Power Stages
The first step in designing a multiphase converter is to
determine the number of phases. This determination
depends heavily on the cost analysis, which in turn depends
on system constraints that differ from one design to the next.
Principally, the designer will be concerned with whether
components can be mounted on both sides of the circuit
board, whether through-hole components are permitted, the
total board space available for power-supply circuitry, and
the maximum amount of load current. Generally speaking,
per-phase currents are possible. In cases where board
space is the limiting constraint, current can be pushed as
high as 40A per phase, but these designs require heat sinks
and forced air to cool the MOSFETs, inductors and heat-
dissipating surfaces.
MOSFETS
The choice of MOSFETs depends on the current each
MOSFET will be required to conduct, the switching frequency,
the capability of the MOSFETs to dissipate heat, and the
availability and nature of heat sinking and air flow.
LOWER MOSFET POWER CALCULATION
The calculation for power loss in the lower MOSFET is
simple, since virtually all of the loss in the lower MOSFET is
due to current conducted through the channel resistance
(r DS(ON) ). In Equation 23, I M is the maximum continuous
output current, I PP is the peak-to-peak inductor current (see
Equation 1), and d is the duty cycle (V OUT /V IN ).
? I M ? 2 I L , PP ? ( 1 – d )
P LOW , 1 = r DS ( ON ) ? ? ------ ? ? ( 1 – d ) + -------------------------------------
the most economical solutions are those in which each
phase handles between 25A and 30A. All surface-mount
designs will tend toward the lower end of this current range.
If through-hole MOSFETs and inductors can be used, higher
31
? N ? 12
(EQ. 23)
FN6328.2
August 2, 2007
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