MAX14830
Quad Serial UART with 128-Word FIFOs
and Internal Oscillator
8
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to AGND.)
VL, VA, VEXT, XIN ................................................ -0.3V to +4.0V
V18, XOUT .................................................. -0.3V to (VA + 0.3V)
RST, IRQ, MOSI/A1, CS/A0, SCLK/SCL,
MISO/SDA, LDOEN, SPI/
I2C.................. -0.3V to (VL + 0.3V)
TX0, RX0, CTS0, GPIO0, GPIO1,
GPIO2, GPIO3..................................... -0.3V to (VEXT + 0.3V)
TX1, RX1, CTS1, GPIO4, GPIO5,
GPIO6, GPIO7..................................... -0.3V to (VEXT + 0.3V)
TX2, RX2, CTS2, GPIO8, GPIO9,
GPIO10, GPIO11................................. -0.3V to (VEXT + 0.3V)
TX3, RX3, CTS3, GPIO12, GPIO13,
GPIO14, GPIO15................................. -0.3V to (VEXT + 0.3V)
DGND.................................................................. -0.3V to +0.3V
Continuous Power Dissipation (TA = +70NC)
48-Pin TQFN (derate 38.5mW/NC above +70NC).....3076.9mW
Operating Temperature Range ........................ -40NC to +85NC
Maximum Junction Temperature ................................. +150NC
Storage Temperature Range ......................... -65NC to +150NC
Lead Temperature (soldering, 10s) ..................................300NC
Soldering Temperature (reflow) .....................................+260NC
DC ELECTRICAL CHARACTERISTICS
(VA = +2.35V to +3.6V, VL = +1.71V to +3.6V, VEXT = +1.71V to +3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values
are at VA = +2.5V, VL = +1.8V, VEXT = +2.8V, TA = +25NC.) (Notes 2, 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (BJA)...........26NC/W
Junction-to-Case Thermal Resistance (BJC)..................1NC/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Digital Interface Supply Voltage
VL
1.71
3.6
V
Analog Supply Voltage
VA
2.35
3.6
V
UART Interface Logic Supply
Voltage
VEXT
1.71
3.6
V
Logic Supply Voltage
V18
1.65
1.95
V
CURRENT CONSUMPTION
VA Supply Current
IA
1.8MHz crystal oscillator active, PLL dis-
abled, SPI/I2C interface idle, UART inter-
faces idle, VLDOEN = VL
400
F
A
Baud rate = 1Mbps, 20MHz external clock,
SPI/I2C interface idle, PLL disabled, all
UARTs in loopback mode, VLDOEN = 0V
0.5
mA
Internal oscillator enabled, PLL = 6x, SPI/
I2C interface idle, baud rate = 115kbps, all
UARTs in loopback mode, VLDOEN = 0V
5
VA Shutdown Supply Current
IASHDN
Shutdown mode, VLDOEN = 0V, VRST = 0V,
all inputs and outputs are idle
35
F
A