50
MCF523x Integrated Microprocessor Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Thermal Characteristics
6.2
Thermal Characteristics
Table lists thermal resistance values
Instantaneous Maximum Current
Single pin limit (applies to all pins) 3, 4, 5
ID
25
mA
Operating Temperature Range (Packaged)
TA
(TL - TH)
– 40 to 85
°C
Storage Temperature Range
Tstg
– 65 to 150
°C
1
Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum
Ratings are stress ratings only, and functional operation at the maxima is not guaranteed.
Continued operation at these levels may affect device reliability or cause permanent damage
to the device.
2
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application of
any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g.,
either VSS or OVDD).
3
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages,
then use the larger of the two values.
4
All functional non-supply pins are internally clamped to VSS and OVDD.
5
Power supply must maintain regulation within operating OVDD range during instantaneous
and operating maximum current conditions. If positive injection current (Vin > OVDD) is greater
than IDD, the injection current may flow out of OVDD and could result in external power supply
going out of regulation. Insure external OVDD load will shunt current greater than maximum
injection current. This will be the greatest risk when the processor is not consuming power
(ex; no clock).Power supply must maintain regulation within operating OVDD range during
instantaneous and operating maximum current conditions.
Table 43. Thermal Characteristics
Characteristic
Symbol
256
MAPBGA
196
MAPBGA
160QFP
Unit
Junction to ambient, natural convection
Four layer board (2s2p)
θJMA
26 1, 2
1
θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Motorola
recommends the use of
θJmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the
Ψjt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
32 3, 4
40 5, 6
°C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
θJMA
°C/W
Junction to board
θJB
15 7
20 8
25 9
°C/W
Junction to case
θJC
10 10
10 11
10 12
°C/W
Junction to top of package
Ψjt
°C/W
Maximum operating junction temperature
Tj
TBD
oC
Table 42. Absolute Maximum Ratings 1, 2
Rating
Symbol
Value
Unit