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| 型号： | MCF5235CVM100 |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | MAPBGA-256 |
| 文件页数： | 47/76页 |
| 文件大小： | 2665K |
| 代理商： | MCF5235CVM100 |
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MOTOROLA
MCF523x Integrated Microprocessor Hardware Specifications
51
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Thermal Characteristics
3
θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Motorola
recommends the use of
θJmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the
Ψjt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
4
Per JEDEC JESD51-6 with the board horizontal.
5
θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Motorola
recommends the use of
θJmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the
Ψjt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
6
Per JEDEC JESD51-6 with the board horizontal.
7
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
8
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
9
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
10 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
11 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
12 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
13 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
14 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
15 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
The average chip-junction temperature (TJ) in °C can be obtained from:
(1)
Where:
TA= Ambient Temperature, °C
Θ
JMA= Package Thermal Resistance, Junction-to-Ambient, °C/W
PD= PINT + PI/O
PINT= IDD × VDD, Watts - Chip Internal Power
PI/O= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
(2)
Solving equations 1 and 2 for K gives:
T
J
T
A
P
D
Θ
JMA
×
()
+
=
P
D
KT
J
273
°C
+
()
÷
=
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF5235CVM100J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF5235CVM150 | 功能描述:IC MPU 32BIT COLDF 256-MAPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MCF523x 标准包装:330 系列:- 核心处理器:- 芯体尺寸:8/16-位 速度:40MHz 连通性:UART/USART 外围设备:DMA，PWM，WDT 输入/输出数:32 程序存储器容量:- 程序存储器类型:外部程序存储器 EEPROM 大小:- RAM 容量:- 电压 - 电源 (Vcc/Vdd):4.5 V ~ 5.5 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:100-BQFP 包装:管件 |
| MCF5235CVM150 | 制造商:Freescale Semiconductor 功能描述:Microprocessor IC |
| MCF5235CVM150J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF5235CVM150J | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 150 MHz 256-BGA |
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