参数资料
型号: MCIMX258CJM4
厂商: Freescale Semiconductor
文件页数: 86/153页
文件大小: 0K
描述: MPU IMX25 IND 400-MAPBGA
特色产品: MCIMX25 Applications Processors
标准包装: 90
系列: i.MX25
核心处理器: ARM9
芯体尺寸: 32-位
速度: 400MHz
连通性: 1 线,CAN,EBI/EMI,以太网,I²C,MMC,智能卡,SPI,SSI,UART/USART,USB OTG
外围设备: DMA,I²S,LCD,POR,PWM,WDT
输入/输出数: 128
程序存储器类型: 外部程序存储器
RAM 容量: 144K x 8
电压 - 电源 (Vcc/Vdd): 1.15 V ~ 1.52 V
数据转换器: A/D 3x12b
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 400-LFBGA
包装: 托盘
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10
38
Freescale Semiconductor
Output pad propagation delay1 (high drive),
40%–60% input signals and crossing of output signals
tpo
15 pF
35 pF
1.85/1.75
2.52/2.42
2.65/2.49
3.51/3.36
3.79/3.55
4.97/4.72
ns
Output pad propagation delay1 (standard drive),
40%–60% input signals and crossing of output signals
tpo
15 pF
35 pF
2.42/2.32
3.76/3.66
3.40/3.25
5.15/4.99
4.83/4.59
7.17/6.92
ns
Output enable to output valid delay1 (max. drive),
50%–50%
tpv
15 pF
35 pF
1.37/1.34
1.77/1.83
2.22/2.02
2.77/2.63
3.53/3.12
4.30/3.92
ns
Output enable to output valid delay1 (high drive),
50%–50%
tpv
15 pF
35 pF
1.55/1.56
2.15/2.29
2.46/2.30
3.28/3.21
3.87/3.47
5.02/4.67
ns
Output enable to output valid delay1 (standard drive),
50%–50%
tpv
15 pF
35 pF
2.07/2.18
3.28/3.65
3.20/3.08
4.84/4.90
4.92/4.50
7.21/6.89
ns
Output enable to output valid delay1 (max. drive),
40%–60%
tpv
15 pF
35 pF
1.46/1.42
1.77/1.81
2.28/2.07
2.71/2.56
3.54/3.13
4.15/3.78
ns
Output enable to output valid delay1 (high drive),
40%–60%
tpv
15 pF
35 pF
1.60/1.59
2.07/2.18
2.47/2.30
3.12/3.02
3.82/3.41
4.72/4.37
ns
Output enable to output valid delay1 (standard drive),
40%–60%
tpv
15 pF
35 pF
2.01/2.09
2.96/3.26
3.05/2.91
4.34/4.37
4.64/4.23
6.45/6.13
ns
Output pad slew rate2 (max. drive)
tps
25 pF
50 pF
1.11/1.20
0.60/0.65
1.74/1.75
0.93/0.95
2.63/2.48
1.39/1.29
V/ns
Output pad slew rate2 (high drive)
tps
25 pF
50 pF
0.75/0.81
0.40/0.43
1.16/1.18
0.62/0.64
1.76/1.65
094/0.87
V/ns
Output pad slew rate2 (standard drive)
tps
25 pF
50 pF
0.38/0.41
0.20/0.22
0.59/0.61
0.31/0.32
0.89/0.83
0.47/0.43
V/ns
Output pad dI/dt3 (max. drive)
tdit
25 pF
50 pF
89
95
202
213
435
456
mA/ns
Output pad dI/dt3 (high drive)
tdit
25 pF
50 pF
60
63
135
142
288
302
mA/ns
Output pad dI/dt3 (standard drive)
tdit
25 pF
50 pF
29
31
67
70
144
150
mA/ns
Input pad transition times4
trfi
1.0 pF
0.07/0.08
0.11/0.12
0.16/0.20
ns
Input pad propagation delay, 50%–50%4
tpi
1.0 pF
0.56/0.69
0.87/1.08
1.37/1.62
ns
Input pad propagation delay, 40%–60%4
tpi
1.38/1.51
1.68/1.89
2.18/2.42
1 Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
bcs model, 1.3 V, I/O 3.6 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
2 Minimum condition for tps: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
3 Maximum condition for tdit: bcs model, 1.3 V, I/O 3.6 V, and –40 °C.
4 Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 3.0 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 3.6 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Table 28. AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O (continued)
Parameter
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
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