参数资料
| 型号： | MCP669T-E/ML |
| 厂商： | Microchip Technology |
| 文件页数： | 18/68页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP QUAD 60MHZ 16QFN |
| 标准包装： | 3,300 |
| 放大器类型： | 通用 |
| 电路数： | 4 |
| 输出类型： | 满摆幅 |
| 转换速率： | 32 V/µs |
| 增益带宽积： | 60MHz |
| 电流 - 输入偏压： | 6pA |
| 电压 - 输入偏移： | 1800µV |
| 电流 - 电源： | 6mA |
| 电流 - 输出 / 通道： | 80mA |
| 电压 - 电源，单路/双路(±)： | 2.5 V ~ 5.5 V，±1.25 V ~ 2.75 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘 |
| 供应商设备封装： | 16-QFN（4x4） |
| 包装： | 带卷 (TR) |
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2009-2012 Microchip Technology Inc.
DS22194D-page 25
MCP660/1/2/3/4/5/9
4.5
MCP663 and MCP665 Chip Select
The MCP663 is a single amplifier with Chip Select
(CS). When CS is pulled high, the supply current drops
to 1 A (typical) and flows through the CS pin to VSS.
When this happens, the amplifier output is put into a
high-impedance state. By pulling CS low, the amplifier
is enabled. The CS pin has an internal 5 M
(typical)
pulldown resistor connected to VSS, so it will go low if
the CS pin is left floating. Figure 1-1, Figure 2-43 and
Figure 2-44 show the output voltage and supply current
response to a CS pulse.
The MCP665 is a dual amplifier with two CS pins; CSA
controls op amp A, and CSB controls op amp B. These
op amps are controlled independently, with an enabled
quiescent current (IQ) of 6 mA/amplifier (typical) and a
disabled IQ of 1 A/amplifier (typical). The IQ seen at
the supply pins is the sum of the two op amps’ IQ; the
typical value for the IQ of the MCP665 will be 2 A, 6
mA or 12 mA when there are 0, 1 or 2 amplifiers
enabled, respectively.
4.6
Power Supply
With this family of operational amplifiers, the power
supply pin (VDD for single supply) should have a local
bypass capacitor (i.e., 0.01 F to 0.1 F) within 2 mm
for good high frequency performance. Surface mount,
multilayer ceramic capacitors, or their equivalent,
should be used.
These op amps require a bulk capacitor (i.e., 2.2 F or
larger) within 50 mm to provide large, slow currents.
Tantalum capacitors, or their equivalent, may be a good
choice. This bulk capacitor can be shared with other
nearby analog parts as long as crosstalk through the
power supplies does not prove to be a problem.
4.7
High Speed PCB Layout
These op amps are fast enough that a little extra care
in the printed circuit board (PCB) layout can make a
significant difference in performance. Good PC board
layout techniques will help you achieve the perfor-
mance shown in the specifications and typical
performance curves; it will also help to minimize
electromagnetic compatibility (EMC) issues.
Use a solid ground plane. Connect the bypass local
capacitor(s) to this plane with minimal length traces.
This cuts down inductive and capacitive crosstalk.
Separate digital from analog, low speed from high
speed, and low power from high power. This will reduce
interference.
Keep sensitive traces short and straight. Separate
them from interfering components and traces. This is
especially important for high frequency (low rise time)
signals.
Sometimes, it helps to place guard traces next to victim
traces. They should be on both sides of the victim
trace, and as close as possible. Connect guard traces
to ground plane at both ends, and in the middle for long
traces.
Use coax cables, or low inductance wiring, to route sig-
nal and power to and from the PCB. Mutual and self
inductance of power wires is often a cause of crosstalk
and unusual behavior.
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