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| 型号： | MPC180LMB |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | MICROPROCESSOR, PQFP100 |
| 封装： | LQFP-100 |
| 文件页数： | 28/28页 |
| 文件大小： | 356K |
| 代理商： | MPC180LMB |
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MOTOROLA
MPC180 Hardware Reference Manual
9
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
6.2 Package Thermal Characteristics
6.3 Operating Conditions and DC Electrical Characteristics
Table 4. Package Thermal Characteristics
Rating
Symbol
Max
Unit
Junction to ambient 1, 2(@200Ifm)
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air ow, board population, and board thermal resistance.
2
Per SEMI G38-87.
Single–layer board
Four–layer board
R40
25
°C/W
Junction to board 3 (bottom)
3
Indicates the average thermal resistance between the die and the printed circuit board.
R17
°C/W
Junction to case 4 (top)
4
Indicates the average thermal resistance between the die and the case top surface via the cold plate method
(MIL SPEC-883 Method 1012.1).
R9
°C/W
Table 5. Electrical Operating Conditions
Characteristic
Name
Min
Typ
Max
Units
Notes
Power supply voltage—Core
VDD
1.65
—
1.95
VDC
Power supply voltage—I/O
VDDQ
3.0
—
3.6
VDC
Input low voltage (Vdd = Min)
Vil
-0.5
—
VDDQ/2
VDC
1
Undershoot: Vil <= 1.5v for t < 20% tKHKH
Input high voltage (Vdd = Max)
Vih
2.0
—
VDC
2
Overshoot: Vih <=VDD +1.0v (Not to exceed 4.6v) for t < 20% tKHKH.
AC supply current
IDD
—
290
mA
Standby supply current
ISS
—
130
mA
Input leakage current @ VDD ≥ Vin ≥ VSS
Ileak
—
+- 5
A
Three-state input current @ VDD ≥ Vin ≥ VSS
Iz
—
10
A
Output high voltage (Ioh = -400 A)
Voh
2.4
—
VDC
Output low voltage
Iol = 3.2 mA, CL = 35 pF (IRQ)
Iol = 3.2 mA, CL = 50 pF (D[0:31])
Vol
—
0.4
VDC
Output HIgh Current
Ioh
10mA
—
mA
3
The TA signal has a +- 15mA output drive strength.
Output Low Current
Iol
—
-10mA
mA
Input buffer/pad capacitance
Cin
—5
—
pF
Input/output buffer/pad capacitance
Cio
—5
—
pF
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