- 您现在的位置：买卖IC网 > PDF目录17049 > MPC8313E-RDB (Freescale Semiconductor)BOARD PROCESSOR PDF资料下载
参数资料
| 型号： | MPC8313E-RDB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 83/99页 |
| 文件大小： | 0K |
| 描述： | BOARD PROCESSOR |
| 产品培训模块： | MPC8313E PowerQUICC Processor MPC8314/15 Product Overview |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MCU |
| 适用于相关产品： | MPC8313E |
| 所含物品： | 参考设计板、软件和说明文档 |
| 相关产品： | MPC8313VRAFFB-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313EZQAFFB-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313EVRAFFB-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313ECZQAFFB-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313ECVRAFFB-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313CZQAFFB-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313CVRAFFB-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313ZQAFF-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313ZQADD-ND - IC MPU POWERQUICC II PRO 516PBGA MPC8313VRAFF-ND - IC MPU POWERQUICC II PRO 516PBGA 更多... |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页当前第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
84
Freescale Semiconductor
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB PD)
where:
TJ = junction temperature (C)
TB = board temperature at the package perimeter (C)
RJB = junction-to-board thermal resistance (C/W) per JESD51–8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
21.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (JT PD)
where:
TJ = junction temperature (C)
TT = thermocouple temperature on top of package (C)
JT = thermal characterization parameter (C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
21.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction to case
thermal resistance and a case to ambient thermal resistance:
RJA = RJC + RCA
where:
RJA = junction-to-ambient thermal resistance (C/W)
RJC = junction-to-case thermal resistance (C/W)
RCA = case-to- ambient thermal resistance (C/W)
相关PDF资料 |
PDF描述 |
|---|---|
| STD01W-J | WIRE & CABLE MARKERS |
| STD09W-C | WIRE & CABLE MARKERS |
| STD09W-T | WIRE & CABLE MARKERS |
| MLK1005S18NJ | INDUCTOR MULTILAYER 18NH 0402 |
| STD02W-R | WIRE & CABLE MARKERS |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8313E-RDBB | 功能描述:开发板和工具包 - 其他处理器 CPU BOARD VER 2.1 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8313E-RDBB | 制造商:Freescale Semiconductor 功能描述:; LEADED PROCESS COMPATIBLE:YES; PEAK RE |
| MPC8313E-RDBC | 功能描述:开发板和工具包 - 其他处理器 8313E CPU board Ver 2.2 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8313EVRADD | 制造商:Freescale Semiconductor 功能描述:MPC83XX RISC 32-BIT 90NM 333MHZ 1V/1.8V/2.5V/3.3V 516-PIN TE - Trays |
| MPC8313EVRADDB | 功能描述:微处理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。