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| 型号： | MPC8313E-RDB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 88/99页 |
| 文件大小： | 0K |
| 描述： | BOARD PROCESSOR |
| 产品培训模块： | MPC8313E PowerQUICC Processor MPC8314/15 Product Overview |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MCU |
| 适用于相关产品： | MPC8313E |
| 所含物品： | 参考设计板、软件和说明文档 |
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MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
89
Output signals on the SerDes interface are fed from the XPADVDD power plane. Input signals and
sensitive transceiver analog circuits are on the XCOREVDD supply.
Power: XPADVDD consumes less than 300 mW; XCOREVDD +SDAVDD consumes less than
750 mW.
22.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8313E system, and the
MPC8313E itself requires a clean, tightly regulated source of power. Therefore, it is recommended that
the system designer place at least one decoupling capacitor at each VDD, NVDD, GVDD, LVDD, LVDDA,
and LVDDB pin of the device. These decoupling capacitors should receive their power from separate VDD,
NVDD, GVDD, LVDD, LVDDA, LVDDB, and VSS power planes in the PCB, utilizing short traces to
minimize inductance. Capacitors may be placed directly under the device using a standard escape pattern.
Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, NVDD, GVDD, LVDD, LVDDA, and LVDDB planes, to enable quick recharging of the
smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating
to ensure the quick response time necessary. They should also be connected to the power and ground
planes through two vias to minimize inductance. Suggested bulk capacitors—100 to 330 F (AVX TPS
tantalum or Sanyo OSCON). However, customers should work directly with their power regulator vendor
for best values and types of bulk capacitors.
22.4
SerDes Block Power Supply Decoupling Recommendations
The SerDes block requires a clean, tightly regulated source of power (XCOREVDD and XPADVDD) to
ensure low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling
scheme is outlined below.
Only SMT capacitors should be used to minimize inductance. Connections from all capacitors to power
and ground should be done with multiple vias to further reduce inductance.
First, the board should have at least 10
10-nF SMT ceramic chip capacitors as close as possible
to the supply balls of the device. Where the board has blind vias, these capacitors should be placed
directly below the chip supply and ground connections. Where the board does not have blind vias,
these capacitors should be placed in a ring around the device as close to the supply and ground
connections as possible.
Second, there should be a 1-F ceramic chip capacitor from each SerDes supply (XCOREVDD and
XPADVDD) to the board ground plane on each side of the device. This should be done for all
SerDes supplies.
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相关代理商/技术参数 |
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| MPC8313E-RDBB | 功能描述:开发板和工具包 - 其他处理器 CPU BOARD VER 2.1 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8313E-RDBB | 制造商:Freescale Semiconductor 功能描述:; LEADED PROCESS COMPATIBLE:YES; PEAK RE |
| MPC8313E-RDBC | 功能描述:开发板和工具包 - 其他处理器 8313E CPU board Ver 2.2 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8313EVRADD | 制造商:Freescale Semiconductor 功能描述:MPC83XX RISC 32-BIT 90NM 333MHZ 1V/1.8V/2.5V/3.3V 516-PIN TE - Trays |
| MPC8313EVRADDB | 功能描述:微处理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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