参数资料
型号: MSC8103VT1100F
厂商: Freescale Semiconductor
文件页数: 25/104页
文件大小: 0K
描述: IC DSP 16BIT 275MHZ 332-FCPBGA
标准包装: 90
系列: StarCore
类型: SC140 内核
接口: 通信处理器模块(CPM)
时钟速率: 275MHz
非易失内存: 外部
芯片上RAM: 512kB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.60V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 332-BFBGA,FCPBGA
供应商设备封装: 332-FCBGA(17x17)
包装: 托盘
CPM Ports
MSC8103 Network Digital Signal Processor, Rev. 12
Freescale Semiconductor
1-23
PB23
FCC2: TXD1
MII and HDLC nibble
SI1 TDMA1: L1RXD2
TDM nibble
SI2 TDMD2: L1TXD
TDM serial
Output
Input
Output
FCC2: MII and HDLC Nibble: Transmit Data Bit 1
TXD1 is bit 1 of the transmit data nibble.
Time-Division Multiplexing A1: Nibble Layer 1 Receive Data Bit 2
L1RXD2 is bit 2 of the receive data nibble.
Time-Division Multiplexing D2: Layer 1 Transmit Data
TDMA1 transmits serial data out of L1TXD.
PB22
FCC2: TXD0
MII and HDLC nibble
FCC2: TXD
HDLC serial and transparent
SI1 TDMA1: L1RXD1
TDM nibble
SI2 TDMD2: L1RXD
TDM serial
Output
Input
FCC2: MII and HDLC Nibble Transmit Data Bit 0
TXD0 is bit 0 and the least significant bit of the transmit data nibble.
FCC2: HDLC Serial and Transparent Transmit Data
Serial data is transmitted via TXD.
Time-Division Multiplexing A1: Nibble Layer 1 Receive Data Bit 1
L1RXD1 is bit 1 of the receive data nibble.
Time-Division Multiplexing D2: Layer 1 Receive Data
Serial data is received via L1RXD.
PB21
FCC2: RXD0
MII and HDLC nibble
FCC2: RXD
HDLC serial and transparent
SI1 TDMA1: L1TXD2
TDM nibble
SI2 TDMD2: L1TSYNC
TDM serial
Input
Output
Input
FCC2: MII and HDLC Nibble Receive Data Bit 0
RXD0 is bit 0 and the least significant bit of the receive data nibble.
FCC2: HDLC Serial and Transparent Receive Data
Serial data is received via RXD.
Time-Division Multiplexing A1: Nibble Layer 1 Transmit Data Bit 2
L1TXD2 is bit 2 of the transmit data nibble.
Time-Division Multiplexing D2: Layer 1 Transmit Synchronize Data
The synchronizing signal for the transmit channel. See the Serial
Interface with Time-Slot Assigner chapter in the MSC8103 Reference
Manual.
PB20
FCC2: RXD1
MII and HDLC nibble
SI1 TDMA1: L1TXD1
TDM nibble
SI2 TDMD2: L1RSYNC
TDM serial
Input
Output
Input
FCC2: MII and HDLC Nibble: Receive Data Bit 1
RXD1 is bit 1 of the receive data nibble.
Time-Division Multiplexing A1: Nibble Layer 1 Transmit Data Bit 1
L1TXD1 is bit 1 of the transmit data nibble.
Time-Division Multiplexing D2: Layer 1 Receive Synchronize Data
The synchronizing signal for the receive channel.
PB19
FCC2: RXD2
MII and HDLC nibble
I2C: SDA
Input
Input/ Output
FCC2: MII and HDLC Nibble Receive Data Bit 2
RXD2 is bit 2 of the receive data nibble.
I2C: Inter-Integrated Circuit Serial Data
The I2C interface comprises two signals: serial data (SDA) and serial
clock (SDA). The I2C controller uses a synchronous, multimaster bus
that can connect several integrated circuits on a board. Clock rates run
up to 520 kHz@25 MHz system clock.
Table 1-8.
Port B Signals (Continued)
Name
Dedicated
I/O Data
Direction
Description
General-
Purpose I/O
Peripheral Controller:
Dedicated I/O
Protocol
相关PDF资料
PDF描述
RBB10DHRD CONN CARD EXTEND 20POS .050"
VE-253-CW-F1 CONVERTER MOD DC/DC 24V 100W
EEC18DRXS CONN EDGECARD 36POS DIP .100 SLD
VE-25N-CW-F1 CONVERTER MOD DC/DC 18.5V 100W
EMM44DSXS CONN EDGECARD 88POS DIP .156 SLD
相关代理商/技术参数
参数描述
MSC8103VT1200F 功能描述:IC DSP 16BIT 300MHZ 332-FCPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:StarCore 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘
MSC81058 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81090 制造商:ASI 制造商全称:ASI 功能描述:NPN SILICON RF POWER TRANSISTOR
MSC81111 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81118 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS