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参数资料
| 型号： | NAND256W3A2CZA1E |
| 厂商： | NUMONYX |
| 元件分类： | PROM |
| 英文描述： | 32M X 8 FLASH 3V PROM, 35 ns, PBGA55 |
| 封装： | 8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-55 |
| 文件页数： | 32/57页 |
| 文件大小： | 916K |
| 代理商： | NAND256W3A2CZA1E |
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NAND128-A, NAND256-A, NAND512-A, NAND01G-A
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Table 21. AC Characteristics for Operations
Note: 1. The time to Ready depends on the value of the pull-up resistor tied to the Ready/Busy pin. See Figures 34, 35 and 36.
2. To break the sequential read cycle, E must be held High for longer than tEHEL.
3. ES = Electronic Signature.
Symbol
Alt.
Symbol
Parameter
1.8V
Devices
3V
Devices
Unit
tALLRL1
tAR
Address Latch Low to
Read Enable Low
Read Electronic Signature
Min
10
ns
tALLRL2
Read cycle
Min
10
ns
tBHRL
tRR
Ready/Busy High to Read Enable Low
Min
20
ns
tBLBH1
Ready/Busy Low to
Ready/Busy High
Read Busy time, 128Mb, 256Mb,
512Mb Dual Die
Max
12
s
Read Busy time, 512Mb, 1Gb
Max
15
12
s
tBLBH2
tPROG
Program Busy time
Max
500
s
tBLBH3
tBERS
Erase Busy time
Max
3
ms
tBLBH4
Reset Busy time, during ready
Max
5
s
tWHBH1
tRST
Write Enable High to
Ready/Busy High
Reset Busy time, during read
Max
5
s
Reset Busy time, during program
Max
10
s
Reset Busy time, during erase
Max
500
s
tCLLRL
tCLR
Command Latch Low to Read Enable Low
Min
10
ns
tDZRL
tIR
Data Hi-Z to Read Enable Low
Min
0
ns
tEHBH
tCRY
Chip Enable High to Ready/Busy High (E intercepted read)
Max
60 + tr
(1)
60 + tr
(1)
ns
tEHEL
tCEH
Chip Enable High to Chip Enable Low(2)
Min
100
ns
tEHQZ
tCHZ
Chip Enable High to Output Hi-Z
Max
20
ns
tELQV
tCEA
Chip Enable Low to Output Valid
Max
45
ns
tRHBL
tRB
Read Enable High to Ready/Busy Low
Max
100
ns
tRHRL
tREH
Read Enable High to
Read Enable Low
Read Enable High Hold time
Min
15
ns
tRHQZ
tRHZ
Read Enable High to Output Hi-Z
Min
15
ns
Max
30
tRLRH
tRP
Read Enable Low to
Read Enable High
Read Enable Pulse Width
Min
30
ns
tRLRL
tRC
Read Enable Low to
Read Enable Low
Read Cycle time
Min
60
50
ns
tRLQV
tREA
Read Enable Low to
Output Valid
Read Enable Access time
Max
35
ns
Read ES Access time(3)
tWHBH
tR
Write Enable High to
Ready/Busy High
Read Busy time, 128Mb, 256Mb,
512Mb Dual Die
Max
12
s
Read Busy time, 512Mb, 1Gb
Max
15
12
s
tWHBL
tWB
Write Enable High to Ready/Busy Low
Max
100
ns
tWHRL
tWHR
Write Enable High to Read Enable Low
Min
80
60
ns
tWLWL
tWC
Write Enable Low to
Write Enable Low
Write Cycle time
Min
60
50
ns
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NAND256W4A0AN6E | 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| NAND32GAH0HZA5E | 制造商:Micron Technology Inc 功能描述:NAND EMMC - Trays |
| NAND32GAH0HZA5F | 制造商:Micron Technology Inc 功能描述:NAND EMMC - Tape and Reel |
| NAND32GAH0PZA5E | 制造商:Micron Technology Inc 功能描述:EMMC 4.3 4GB 12X16 41NM - Trays |
| NAND32GAH0PZA5F | 制造商:Micron Technology Inc 功能描述:NAND EMMC - Tape and Reel |
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