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参数资料
型号： S29JL032H60TAI023
厂商： ADVANCED MICRO DEVICES INC
元件分类： PROM
英文描述： 2M X 16 FLASH 3V PROM, 60 ns, PDSO48
封装： MO-142DD, TSOP-48
文件页数： 64/66页
文件大小： 1691K
代理商： S29JL032H60TAI023
March 10, 2005 S29JL032H_00A11
S29JL032H
5
Ad vance
Info rmat i o n
Table Of Contents
Notice On Data Sheet Designations . . . . . . . . . . . 2
Advance Information .......................................................2
Preliminary ................................................................................................ 2
Combination ............................................................................................. 2
Full Production (No Designation on Document) ......................... 2
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .8
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 11
Table 1. S29JL032H Device Bus Operations ..........................11
Requirements for Reading Array Data ........................................... 12
Writing Commands/Command Sequences ................................... 12
Accelerated Program Operation ...................................................... 13
Autoselect Functions ............................................................................ 13
Simultaneous Read/Write Operations with Zero Latency ....... 13
Automatic Sleep Mode ......................................................................... 14
RESET#: Hardware Reset Pin ............................................................ 14
Output Disable Mode ........................................................................... 15
Table 2. S29JL032H Bank Architecture .................................15
Table 3. S29JL032H Sector Addresses - Top Boot Devices ......16
Table 4. S29JL032H Sector Addresses - Bottom Boot Devices .18
Table 5. S29JL032H Autoselect Codes, (High Voltage Method) 20
Sector/Sector Block Protection and Unprotection .................... 21
Table 6. S29JL032H Boot Sector/Sector Block Addresses for Pro-
tection/Unprotection (Top Boot Devices) ..............................21
Table 7. S29JL032H Sector/Sector Block Addresses for Protection/
Unprotection (Bottom Boot Devices) ....................................22
Table 8. WP#/ACC Modes ..................................................23
Temporary Sector Unprotect .......................................................... 23
Figure 1. Temporary Sector Unprotect Operation................... 24
Figure 2. In-System Sector Protect/Unprotect Algorithms ....... 25
SecSi (Secured Silicon) Sector
Flash Memory Region .......................................................................... 26
Hardware Data Protection ................................................................ 27
Low VCC Write Inhibit ...................................................................... 27
Write Pulse “Glitch” Protection ...................................................... 27
Logical Inhibit ......................................................................................... 27
Power-Up Write Inhibit ..................................................................... 27
Common Flash Memory Interface (CFI) . . . . . . .27
Table 9. CFI Query Identification String ...............................28
Table 10. System Interface String .......................................28
Table 11. Device Geometry Definition ..................................29
Table 12. Primary Vendor-Specific Extended Query ................29
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 31
Reading Array Data .............................................................................. 31
Reset Command .................................................................................... 31
Autoselect Command Sequence ...................................................... 32
Enter SecSi Sector/Exit SecSi Sector
Command Sequence ............................................................................ 32
Byte/Word Program Command Sequence ................................... 32
Unlock Bypass Command Sequence ................................................33
Figure 3. Program Operation .............................................. 34
Chip Erase Command Sequence ...................................................... 34
Sector Erase Command Sequence ...................................................35
Figure 4. Erase Operation .................................................. 36
Erase Suspend/Erase Resume Commands .................................... 36
Table 13. S29JL032H Command Definitions ......................... 38
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 39
DQ7: Data# Polling .............................................................................. 39
Figure 5. Data# Polling Algorithm ....................................... 40
DQ6: Toggle Bit I ................................................................................... 41
Figure 6. Toggle Bit Algorithm ............................................ 42
DQ2: Toggle Bit II ................................................................................ 42
Reading Toggle Bits DQ6/DQ2 ........................................................ 43
DQ5: Exceeded Timing Limits .......................................................... 43
DQ3: Sector Erase Timer .................................................................. 43
Table 14. Write Operation Status ....................................... 44
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 45
Figure 7. Maximum Negative Overshoot Waveform................ 45
Figure 8. Maximum Positive Overshoot Waveform ................. 45
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . .45
Industrial (I) Devices ............................................................................ 45
VCC Supply Voltages ............................................................................ 45
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 46
CMOS Compatible ...............................................................................46
Figure 9. ICC1 Current vs. Time (Showing Active and
Automatic Sleep Currents) ................................................. 47
Figure 10. Typical ICC1 vs. Frequency .................................. 47
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 11. Test Setup ....................................................... 48
Key To Switching Waveforms . . . . . . . . . . . . . . . .48
Figure 12. Input Waveforms and Measurement Levels............ 48
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 49
Read-Only Operations ......................................................................49
Figure 13. Read Operation Timings...................................... 49
Hardware Reset (RESET#) ................................................................ 50
Figure 14. Reset Timings ................................................... 50
Word/Byte Configuration (BYTE#) ................................................. 51
Figure 15. BYTE# Timings for Read Operations ..................... 52
Figure 16. BYTE# Timings for Write Operations..................... 52
Erase and Program Operations .........................................................53
Figure 17. Program Operation Timings ................................. 54
Figure 18. Accelerated Program Timing Diagram ................... 54
Figure 19. Chip/Sector Erase Operation Timings.................... 55
Figure 20. Back-to-back Read/Write Cycle Timings ................ 56
Figure 21. Data# Polling Timings (During Embedded Algorithms)
...................................................................................... 56
Figure 22. Toggle Bit Timings (During Embedded Algorithms) . 57
Figure 23. DQ2 vs. DQ6..................................................... 57
Temporary Sector Unprotect .......................................................... 58
Figure 24. Temporary Sector Unprotect Timing Diagram......... 58
Figure 25. Sector/Sector Block Protect and
Unprotect Timing Diagram ................................................. 59
Alternate CE# Controlled Erase and Program Operations ....60
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings............................................................. 61
Erase And Programming Performance . . . . . . . . 62
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 62
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 63
TS 048—48-Pin Standard TSOP ...................................................... 63
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 64
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