S71GL064A04BAW0F3 PDF资料下载(51/102 页)Stacked Multi-Chip Product (MCP) Flash Memory and RAM

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参数资料

型号：	S71GL064A04BAW0F3
厂商：	Spansion Inc.
英文描述：	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述：	堆叠式多芯片产品（MCP）的闪存和RAM
文件页数：	51/102页
文件大小：	1606K
代理商：	S71GL064A04BAW0F3

S71GL032A Based MCPs

S71GL032A_00_A0 March 31, 2005

Advance

Info rmation

Any commands written during the chip erase operation are ignored. However,

note that a hardware reset immediately terminates the erase operation. If that

occurs, the chip erase command sequence should be reinitiated once the device

has returned to reading array data, to ensure data integrity.

Figure 6 illustrates the algorithm for the erase operation. Refer to the Erase and

Program Operations table in the AC Characteristics section for parameters, and

Figure 18 section for timing diagrams.

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相关代理商/技术参数	参数描述
S71GL064A04BFI0B0	制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0B2	制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0B3	制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F0	制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F2	制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM

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