参数资料
型号: S71GL064A04BAW0F3
厂商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: 堆叠式多芯片产品(MCP)的闪存和RAM
文件页数: 74/102页
文件大小: 1606K
代理商: S71GL064A04BAW0F3
March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
73
Advance
Informatio n
Notes:
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”.)
2. Illustration shows device in word mode.
Figure 18. Chip/Sector Erase Operation Timings
Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array
data read cycle.
Figure 19. Data# Polling Timings (During Embedded Algorithms)
OE#
CE#
Addresses
VCC
WE#
Data
2AAh
SA
tAH
tWP
tWC
tAS
tWPH
555h for chip erase
10 for Chip Erase
30h
tDS
tVCS
tCS
tDH
55h
tCH
Status
DOUT
tWHWH2
VA
Erase Command Sequence (last two cycles)
Read Status Data
RY/BY#
tRB
tBUSY
WE#
CE#
OE#
High Z
tOE
High Z
DQ7
DQ0–DQ6
RY/BY#
tBUSY
Complement
True
Addresses
VA
tCH
VA
Status Data
Complement
Status Data
True
Valid Data
tPOLL
tACC
tCE
tOEH
tDF
tOH
tRC
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S71GL064A04BFI0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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