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型号： TSX68C000MCB/C12.5A
厂商： E2V TECHNOLOGIES PLC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 12.5 MHz, MICROPROCESSOR, CDIP64
封装： CERAMIC, SDIP-64
文件页数： 6/54页
文件大小： 901K
代理商： TSX68C000MCB/C12.5A
14
0853B–HIREL–09/07
TS68C000
e2v semiconductors SAS 2007
These terms are related by the equation:
θ
JA = θJC + θCA
(4)
θ
JA is device related and cannot be influenced by the user. However, θCA is user dependent and can be
minimized by such thermal management techniques as heat sinks, ambient air cooling and thermal con-
vection. Thus, good thermal management on the part of the user can significantly reduce
θ
CA so that θJA
approximately equals
θ
JC. Substitution of θJC for θJA in equation (1) will result in a lower semiconductor
junction temperature.
2.4.6
Mechanical and Environmental
The microcircuits shall meet all mechanical environmental requirements of MIL-STD-883 for class B
devices.
2.4.7
Marking
The document where are defined the marking are identified in the related reference documents. Each
microcircuit is legible and permanently marked with the following information as minimum:
e2v Logo
Manufacturer’s Part Number
Class B Identification
Date-code of inspection lot
ESD Identifier if Available
Country of Manufacturing
2.5
Quality Conformance Inspection
2.5.1
DESC/MIL-STD-883
Is in accordance with MIL-PRF-38535 and method 5005 of MIL-STD-883. Group A and B inspections
are performed on each production lot. Group C and D inspection are performed on a periodical basis.
2.6
Electrical Characteristics
2.6.1
General Requirements
All static and dynamic electrical characteristics specified for inspection purposes and the relevant mea-
surements conditions are given below:
Table 2-4: Static Electrical Characteristics for all electrical variants.
Table 2-5, Table 2-6, Table 2-7 and Table 2-8: Dynamic electrical characteristics for 8 MHz, 10 MHz
and 12.5 MHz.
For static characteristics (Table 2-4), test methods refer to IEC 748-2 method number, where existing.
For dynamic characteristics, test methods refer to clause “Test Conditions Specific to the Device” on
page 27 of this specification (Table 2-5, Table 2-6, Table 2-7 and Table 2-8).
Indication of "min" or "max" in the column "test temperature" means minimum or maximum operating
temperatures as defined in sub-clause “Recommended Condition of Use and Guaranteed Characteris-
tics” on page 11 here above.
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