参数资料
型号: W947D6HBHX5E
厂商: Winbond Electronics
文件页数: 3/60页
文件大小: 0K
描述: IC LPDDR SDRAM 128MBIT 60VFBGA
标准包装: 312
格式 - 存储器: RAM
存储器类型: 移动 LPDDR SDRAM
存储容量: 128M(8Mx16)
速度: 200MHz
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: -25°C ~ 85°C
封装/外壳: 60-TFBGA
供应商设备封装: 60-VFBGA(8x9)
包装: 托盘
W947D6HB / W947D2HB
128Mb Mobile LPDDR
7.13.1 Deep Power-Down Entry and Exit.......................................................................................................44
7.14 Clock Stop .................................................................................................................................... 45
7.14.1 Clock Stop Mode Entry and Exit .........................................................................................................45
8. ELECTRICAL CHARACTERISTIC ........................................................................................... 46
8.1 Absolute Maximum Ratings ............................................................................................................ 46
8.2 Input/Output Capacitance ............................................................................................................... 46
8.3 Electrical Characteristics and AC/DC Operating Conditions ........................................................... 47
8.3.1 Electrical Characteristics and AC/DC Operating Conditions ................................................................47
8.4 IDD Specification Parameters and Test Conditions ........................................................................ 48
8.4.1 IDD Specification Parameters and Test Conditions ..............................................................................48
8.5 AC Timings..................................................................................................................................... 51
8.5.1 CAS Latency Definition (With CL=3) .....................................................................................................54
8.5.2 Output Slew Rate Characteristics .........................................................................................................55
8.5.3 AC Overshoot/Undershoot Specification ..............................................................................................55
8.5.4 AC Overshoot and Undershoot Definition .............................................................................................55
9. PACKAGE DIMENSIONS ......................................................................................................... 56
9.1: LPDDR X 16 .................................................................................................................................. 56
9.2: LPDDR X 32 .................................................................................................................................. 57
10. ORDERING INFORMATION ................................................................................................... 58
11. REVISION HISTORY ............................................................................................................... 59
Publication Release Date:Jun,17, 2011
- 3 -
Revision A01-003
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相关代理商/技术参数
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W947D6HBHX5I 制造商:WINBOND 制造商全称:Winbond 功能描述:128Mb Mobile LPDDR
W947D6HBHX5I TR 制造商:Winbond Electronics Corp 功能描述:
W947D6HBHX6E 制造商:Winbond Electronics Corp 功能描述:IC LPDDR SDRAM 128MBIT 60VFBGA
W947D6HBHX6G 制造商:WINBOND 制造商全称:Winbond 功能描述:128Mb Mobile LPDDR
W948D2FB 制造商:WINBOND 制造商全称:Winbond 功能描述:256Mb Mobile LPDDR