参数资料
型号: W947D6HBHX5E
厂商: Winbond Electronics
文件页数: 52/60页
文件大小: 0K
描述: IC LPDDR SDRAM 128MBIT 60VFBGA
标准包装: 312
格式 - 存储器: RAM
存储器类型: 移动 LPDDR SDRAM
存储容量: 128M(8Mx16)
速度: 200MHz
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: -25°C ~ 85°C
封装/外壳: 60-TFBGA
供应商设备封装: 60-VFBGA(8x9)
包装: 托盘
W947D6HB / W947D2HB
128Mb Mobile LPDDR
-5
-6
- 75
PARAMETER
SYMBOL
UNIT
NOTES
MIN
MAX
MIN
MAX
MIN
MAX
period
Write preamble setup time
tWPRES
0
0
0
ns
21
Write postamble
tWPST
0.4
0.6
0.4
0.6
0.4
0.6
tCK
22
Write preamble
tWPRE
0.25
0.25
0.25
tCK
CL = 3
0.9
1.1
0.9
1.1
0.9
1.1
tCK
23
Read preamble
tRPRE
CL = 2
0.5
1.1
0.5
1.1
0.5
1.1
tCK
23
Read postamble
ACTIVE to PRECHARGE command
period
tRPST
tRAS
0.4
40
0.6
70,000
0.4
42
0.6
70,000
0.4
45
0.6
70,000
tCK
ns
ACTIVE to ACTIVE command period
AUTO REFRESH to ACTIVE/AUTO
REFRESH command period
ACTIVE to READ or WRITE delay
PRECHARGE command period
ACTIVE bank A to ACTIVE bank B
delay
tRC
tRFC
tRCD
tRP
tRRD
tRAS+
tRP
72
15
3
10
tRAS+
tRP
72
18
3
12
tRAS+
tRP
72
22.5
3
15
ns
ns
ns
tCK
ns
WRITE recovery time
Auto precharge write recovery +
precharge time
Internal write to Read command delay
Self Refresh exit to next valid command
delay
Exit power down to next valid command
delay
CKE min. pulse width (high and low
pulse width)
Refresh Period
Average periodic refresh interval
MRS for SRR to READ
READ of SRR to next valid command
tWR
tDAL
tWTR
tXSR
tXP
tCKE
tREF
tREFI
tSRR
tSRC
15
-
2
120
2
1
2
CL+1
64
15.6
15
-
2
120
1
1
2
CL+1
64
15.6
15
-
1
120
1
1
2
CL+1
64
15.6
ns
tCK
tCK
ns
tCK
tCK
ms
μs
tCK
tCK
24
25
26
27
28
Publication Release Date:Jun,17, 2011
- 52 -
Revision A01-003
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W947D6HBHX5I 制造商:WINBOND 制造商全称:Winbond 功能描述:128Mb Mobile LPDDR
W947D6HBHX5I TR 制造商:Winbond Electronics Corp 功能描述:
W947D6HBHX6E 制造商:Winbond Electronics Corp 功能描述:IC LPDDR SDRAM 128MBIT 60VFBGA
W947D6HBHX6G 制造商:WINBOND 制造商全称:Winbond 功能描述:128Mb Mobile LPDDR
W948D2FB 制造商:WINBOND 制造商全称:Winbond 功能描述:256Mb Mobile LPDDR