参数资料
型号: W972GG8JB-25I
厂商: WINBOND ELECTRONICS CORP
元件分类: DRAM
英文描述: 256M X 8 DDR DRAM, 0.4 ns, PBGA60
封装: 11 X 11.50 MM, ROHS COMPLIANT, WBGA-60
文件页数: 62/86页
文件大小: 1466K
代理商: W972GG8JB-25I
W972GG8JB
Publication Release Date: Feb. 18, 2011
- 65 -
Revision A02
9.12 AC Input Test Conditions
Input reference voltage
VREF
0.5 x VDDQ
V
1
Input signal maximum peak to peak swing
VSWING(MAX)
1.0
V
1
Input signal minimum slew rate
SLEW
1.0
V/nS
2, 3
Notes:
1. Input waveform timing is referenced to the input signal crossing through the VIH/IL(ac) level applied to the device under test.
2. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(ac) min for rising edges and the
range from VREF to VIL(ac) max for falling edges as shown in the below figure.
3. AC timings are referenced with input waveforms switching from VIL(ac) to VIH(ac) on the positive transitions and VIH(ac) to
VIL(ac) on the negative transitions.
9.13 Differential Input/Output AC Logic Levels
PARAMETER
SYM.
MIN.
MAX.
UNIT
NOTES
AC differential input voltage
VID (ac)
0.5
VDDQ + 0.6
V
1
AC differential cross point input voltage
VIX (ac)
0.5 x VDDQ - 0.175
0.5 x VDDQ + 0.175
V
2
AC differential cross point output voltage
VOX (ac)
0.5 x VDDQ - 0.125
0.5 x VDDQ + 0.125
V
3
Notes:
1. VID (ac) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input signal (such
as CLK, DQS) and VCP is the complementary input signal (such as
CLK , DQS ). The minimum value is equal to VIH (ac) -
VIL (ac).
2. The typical value of VIX (ac) is expected to be about 0.5 x VDDQ of the transmitting device and VIX (ac) is expected to track
variations in VDDQ. VIX (ac) indicates the voltage at which differential input signals must cross.
3. The typical value of VOX (ac) is expected to be about 0.5 x VDDQ of the transmitting device and VOX (ac) is expected to
track variations in VDDQ. VOX (ac) indicates the voltage at which differential output signals must cross.
ΔTF
ΔTR
VDDQ
VIH(ac) min
Falling Slew =
Rising Slew =
VIH(dc) min
VREF
VIL(dc) max
VIL(ac) max
VSS
VSWING(MAX)
VREF - VIL(ac) max
ΔTF
VIH(ac) min - VREF
ΔTR
VDDQ
VSSQ
VIX or VOX
VID
VTR
Crossing point
VCP
Figure 28
– AC input test signal and Differential signal levels waveform
相关PDF资料
PDF描述
W972GG8JB-18 256M X 8 DDR DRAM, 0.35 ns, PBGA60
W9751G6JB-18 32M X 16 DDR DRAM, 0.35 ns, PBGA84
W981204AH-8H 32M X 4 SYNCHRONOUS DRAM, 6 ns, PDSO54
W981216BH75L 8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
W981216BH-75 8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
相关代理商/技术参数
参数描述
W972GG8JB-3 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 2G-Bit 256Mx8 1.8V 60-Pin WBGA 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 2GBIT 3NS
W9751G6IB-25 功能描述:IC DDR2-800 SDRAM 512MB 84-WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.173",4.40mm 宽) 供应商设备封装:8-MFP 包装:带卷 (TR)
W9751G6JB 制造商:WINBOND 制造商全称:Winbond 功能描述:8M ? 4 BANKS ? 16 BIT DDR2 SDRAM
W9751G6JB-25 制造商:Winbond Electronics Corp 功能描述:512GB DDRII
W9751G6JB-3 制造商:Winbond Electronics Corp 功能描述:512MB DDRII