- 您现在的位置：买卖IC网 > PDF目录68559 > W972GG8JB-25I (WINBOND ELECTRONICS CORP) 256M X 8 DDR DRAM, 0.4 ns, PBGA60 PDF资料下载
参数资料
| 型号： | W972GG8JB-25I |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | DRAM |
| 英文描述： | 256M X 8 DDR DRAM, 0.4 ns, PBGA60 |
| 封装： | 11 X 11.50 MM, ROHS COMPLIANT, WBGA-60 |
| 文件页数： | 86/86页 |
| 文件大小： | 1466K |
| 代理商： | W972GG8JB-25I |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页当前第86页
W972GG8JB
Publication Release Date: Feb. 18, 2011
- 9 -
Revision A02
7.
FUNCTIONAL DESCRIPTION
7.1
Power-up and Initialization Sequence
DDR2 SDRAMs must be powered up and initialized in a predefined manner. Operational procedures
other than those specified may result in undefined operation. The following sequence is required for
Power-up and Initialization.
1. Apply power and attempt to maintain CKE below 0.2 × VDDQ and ODT
*1 at a LOW state (all other
inputs may be undefined.) Either one of the following sequence is required for Power-up.
A. The VDD voltage ramp time must be no greater than 200 mS from when VDD ramps from 300
mV to VDD min; and during the VDD voltage ramp, |VDD -VDDQ|
≤ 0.3 volts.
VDD, VDDL and VDDQ are driven from a single power converter output
VTT is limited to 0.95V max
VREF
*2 tracks VDDQ/2
VDDQ
≥ VREF must be met at all times
B. Voltage levels at I/Os and outputs must be less than VDDQ during voltage ramp time to avoid
DRAM latch-up. During the ramping of the supply voltages, VDD
≥ VDDL ≥ VDDQ must be
maintained and is applicable to both AC and DC levels until the ramping of the supply voltages
is complete.
Apply VDD/VDDL
*3 before or at the same time as VDDQ
Apply VDDQ
*4 before or at the same time as VTT
VREF
*2 tracks VDDQ/2
VDDQ
≥ VREF must be met at all times.
2. Start Clock and maintain stable condition for 200 S (min.).
3. After stable power and clock (CLK, CLK ), apply NOP or Deselect and take CKE HIGH.
4. Wait minimum of 400 nS then issue precharge all command. NOP or Deselect applied during 400
nS period.
5. Issue an EMRS command to EMR (2). (To issue EMRS command to EMR (2), provide LOW to
BA0 and BA2, HIGH to BA1.)
6. Issue an EMRS command to EMR (3). (To issue EMRS command to EMR (3), provide LOW to
BA2, HIGH to BA0 and BA1.)
7. Issue EMRS to enable DLL. (To issue DLL Enable command, provide LOW to A0, HIGH to BA0
and LOW to BA1-BA2 and A13-A14. And A9=A8=A7=LOW must be used when issuing this
command.)
8. Issue a Mode Register Set command for DLL reset. (To issue DLL Reset command, provide HIGH
to A8 and LOW to BA0-BA2 and A13-A14.)
9. Issue a precharge all command.
10. Issue 2 or more Auto Refresh commands.
11. Issue a MRS command with LOW to A8 to initialize device operation. (i.e. to program operating
parameters without resetting the DLL.)
12. At least 200 clocks after step 8, execute OCD Calibration (Off Chip Driver impedance adjustment).
If OCD calibration is not used, EMRS to EMR (1) to set OCD Calibration Default
(A9=A8=A7=HIGH)
followed
by
EMRS
to
EMR
(1)
to
exit
OCD
Calibration
Mode
(A9=A8=A7=LOW) must be issued with other operating parameters of EMR(1).
13. The DDR2 SDRAM is now ready for normal operation.
相关PDF资料 |
PDF描述 |
|---|---|
| W972GG8JB-18 | 256M X 8 DDR DRAM, 0.35 ns, PBGA60 |
| W9751G6JB-18 | 32M X 16 DDR DRAM, 0.35 ns, PBGA84 |
| W981204AH-8H | 32M X 4 SYNCHRONOUS DRAM, 6 ns, PDSO54 |
| W981216BH75L | 8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54 |
| W981216BH-75 | 8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W972GG8JB-3 | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 2G-Bit 256Mx8 1.8V 60-Pin WBGA 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 2GBIT 3NS |
| W9751G6IB-25 | 功能描述:IC DDR2-800 SDRAM 512MB 84-WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR) |
| W9751G6JB | 制造商:WINBOND 制造商全称:Winbond 功能描述:8M ? 4 BANKS ? 16 BIT DDR2 SDRAM |
| W9751G6JB-25 | 制造商:Winbond Electronics Corp 功能描述:512GB DDRII |
| W9751G6JB-3 | 制造商:Winbond Electronics Corp 功能描述:512MB DDRII |
发布紧急采购，3分钟左右您将得到回复。