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| 型号： | A42MX24-3VQ100A |
| 厂商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 40MX and 42MX FPGA Families |
| 中文描述： | 40MX和42MX FPGA系列 |
| 文件页数： | 17/93页 |
| 文件大小： | 854K |
| 代理商： | A42MX24-3VQ100A |
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24
Data Device Corporation
www.ddc-web.com
BU-6474X/6484X/6486X
J-07/05-0
BC MESSAGE SEQUENCE CONTROL
The Mini-ACE Mark3 BC message sequence control capability
enables a high degree of offloading of the host processor. This
includes using the various timing functions to enable
autonomous structuring of major and minor frames. In addition,
by implementing conditional jumps and subroutine calls, the
message sequence control processor greatly simplifies the
insertion of asynchronous, or "out-of-band" messages.
EXECUTE AND FLIP OPERATION
The Mini-ACE Mark3 BC's XQF, or "Execute and Flip" operation,
provides some unique capabilities. Following execution of this
unconditional instruction, if the condition code tests TRUE, the
BC will modify the value of the current XQF instruction's pointer
parameter by toggling bit 4 of the pointer. That is, if the selected
condition flag tests true, the value of the parameter will be
updated to the value = old address XOR 0010h. As a result, the
next time that this line in the instruction list is executed, the
Message Control/Status Block at the updated address (old
address XOR 0010h) will be processed, rather than the one at
the old address. The operation of the XQF instruction is illustrat-
ed in FIGURE 4.
There are multiple ways of utilizing the "execute and flip" instruc-
tion. One is to facilitate the implementation of a double buffering
data scheme for individual messages. This allows the message
sequence control processor to "ping-pong" between a pair of
data buffers for a particular message. By doing so, the host
processor can access one of the two Data Word blocks, while the
BC reads or writes the alternate Data Word block.
A second application of the "execute and flip" capability is in con-
junction with message retries. This allows the BC to not only
switch buses when retrying a failed message, but to automati-
cally switch buses permanently for all future times that the same
message is to be processed. This not only provides a high
degree of autonomy from the host CPU, but saves BC band-
width, by eliminating the need for future attempts to process
messages on an RT's failed channel.
XQF
POINTER
XX00h
(part of) BC INSTRUCTION LIST
MESSAGE
CONTROL/STATUS
BLOCK 0
DATA BLOCK 0
XX00h
MESSAGE
CONTROL/STATUS
BLOCK 1
DATA BLOCK 1
POINTER
FIGURE 4. EXECUTE and FLIP (XQF) OPERATION
相关PDF资料 |
PDF描述 |
|---|---|
| A42MX24-3VQ100B | 40MX and 42MX FPGA Families |
| A42MX36-2PQ100B | 40MX and 42MX FPGA Families |
| A42MX36-2PQ100ES | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100 | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100A | 40MX and 42MX FPGA Families |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A42MX24-FPL84 | 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPLG84 | 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQ160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQ208 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQG160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
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