参数资料
型号: ADUC7129BSTZ126-RL
厂商: Analog Devices Inc
文件页数: 91/92页
文件大小: 0K
描述: IC DAS MCU ARM7 ADC/DDS 80-LQFP
产品培训模块: ARM7 Applications & Tools
Intro to ARM7 Core & Microconverters
Process Control
Direct Digital Synthesis Tutorial Series (1 of 7): Introduction
标准包装: 1
系列: MicroConverter® ADuC7xxx
核心处理器: ARM7
芯体尺寸: 16/32-位
速度: 41.78MHz
连通性: EBI/EMI,I²C,SPI,UART/USART
外围设备: PLA,POR,PWM,PSM,温度传感器,WDT
输入/输出数: 38
程序存储器容量: 126KB(63K x 16)
程序存储器类型: 闪存
RAM 容量: 8K x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 3.6 V
数据转换器: A/D 10x12b; D/A 1x10b
振荡器型: 内部
工作温度: -40°C ~ 125°C
封装/外壳: 80-LQFP
包装: 标准包装
其它名称: ADUC7129BSTZ126-RLDKR
ADuC7128/ADuC7129
Rev. 0 | Page 91 of 92
OUTLINE DIMENSIONS
*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
06
30
06
-B
PIN 1
INDICATOR
TOP
VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
17
49
48
32
33
0.50
0.40
0.30
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
*4.85
4.70 SQ
4.55
EXPOSED PAD
(BOTTOM VIEW)
0.30
0.25
0.18
SEATING
PLANE
PIN 1
INDICATOR
THE EXPOSE PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
16
Figure 73. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
05
17
06
-A
TOP VIEW
(PINS DOWN)
1
16
17
33
32
48
49
64
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
12.20
12.00 SQ
11.80
PIN 1
1.60
MAX
0.75
0.60
0.45
10.20
10.00 SQ
9.80
VIEW A
0.20
0.09
1.45
1.40
1.35
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
0.15
0.05
3.5°
Figure 74. 64-Lead Low Profile Quad Flat Package [LQFP]
(ST-64-2)
Dimensions shown in millimeters
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