参数资料
型号: AGLE3000V2-FG896I
厂商: Microsemi SoC
文件页数: 126/166页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
标准包装: 27
系列: IGLOOe
逻辑元件/单元数: 75264
RAM 位总计: 516096
输入/输出数: 620
门数: 3000000
电源电压: 1.14 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 896-BGA
供应商设备封装: 896-FBGA(31x31)
IGLOOe DC and Switching Characteristics
2-48
Revision 13
Timing Characteristics
1.2 V DC Core Voltage
1.2 V LVCMOS Wide Range
Timing Characteristics
Refer to LVCMOS 1.2 V (normal range) "Timing Characteristics" on page 2-48 for worst-case timing.
Table 2-66 1.2 LVCMOS Low Slew – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.14 V
Drive Strength
Speed
Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL
tZH
tLZ
tHZ
tZLS
tZHS Units
2 mA
Std.
1.55
9.92 0.26 2.09 2.95
1.10
9.53 7.48 4.02
3.67
15.31 13.26
ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-6 for derating values.
Table 2-67 1.2 LVCMOS High Slew – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.14 V
Drive Strength
Speed
Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL
tZH
tLZ
tHZ
tZLS
tZHS Units
2 mA
Std.
1.55
4.06 0.26 2.09 2.95
1.10
3.92 3.46 4.01
3.79
9.71
9.24
ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-6 for derating values.
Table 2-68 Minimum and Maximum DC Input and Output Levels
1.2 V LVCMOS
Wide Range1
VIL
VIH
VOL
VOH
IOL IOH IOSH IOSL IIL2 IIH3
Drive
Strength
Equivalent
Software
Default
Drive
Strength
Option4
Min.
(V)
Max.
(V)
Min.
(V)
Max
(V)
Max.
(V)
Min.
(V)
A A
Max.
(mA)5
Max.
(mA)5 A6 A6
100 A
2 mA
–0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 100 100
20
26
10 10
Notes:
1. Applicable to V2 devices ONLY.
2. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
3. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI . Input current is
larger when operating outside recommended ranges.
4. The minimum drive strength for any LVCMOS 1.2 V software configuration when run in wide range is ±100 A. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
5. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
6. Currents are measured at 85°C junction temperature.
7. Software default selection highlighted in gray.
相关PDF资料
PDF描述
24LC024T/SN IC EEPROM 2KBIT 400KHZ 8SOIC
AGLE3000V2-FGG896I IC FPGA 1KB FLASH 3M 896-FBGA
M1AGLE3000V2-FGG896I IC FPGA 1KB FLASH 3M 896-FBGA
24LC024T-I/SN IC EEPROM 2KBIT 400KHZ 8SOIC
APA1000-PQG208I IC FPGA PROASIC+ 1M 208-PQFP
相关代理商/技术参数
参数描述
AGLE3000V2-FG896PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE3000V2-FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V2-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V2-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V2-FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology