参数资料
型号: AGLE3000V2-FG896I
厂商: Microsemi SoC
文件页数: 69/166页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
标准包装: 27
系列: IGLOOe
逻辑元件/单元数: 75264
RAM 位总计: 516096
输入/输出数: 620
门数: 3000000
电源电压: 1.14 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 896-BGA
供应商设备封装: 896-FBGA(31x31)
Datasheet Information
5-4
Revision 13
Revision
Changes
Page
Revision 8 (Nov 2009) The version changed to v2.0 for IGLOOe datasheet chapters, indicating the
datasheet contains information based on final characterization.
N/A
Product Brief v2.0
The "Pro (Professional) I/O" section was revised to add "Hot-swappable and cold-
sparing I/Os."
The "Reprogrammable Flash Technology" section was revised to add "250 MHz
(1.5 V systems) and 160 MHz (1.2 V systems) System Performance."
Definitions of hot-swap and cold-sparing were added to the "Pro I/Os with
DC
and
Switching
Characteristics v2.0
3.3 V LVCMOS and 1.2 V LVCMOS Wide Range support was added to the
datasheet. This affects all tables that contained 3.3 V LVCMOS and 1.2 V
LVCMOS data.
N/A
IIL and IIH input leakage current information was added to all "Minimum and
Maximum DC Input and Output Levels" tables.
N/A
Values for 1.2 V wide range DC core supply voltage were added to Table 2-2
Recommended Operating Conditions 1. Table notes regarding 3.3 V wide range
and the core voltage required for programming were added to the table.
Delays (1.5 V DC core supply voltage) and Table 2-7 Temperature and Voltage
Derating Factors for Timing Delays (1.2 V DC core supply voltage) was revised.
3.3 V LVCMOS wide range data was included in Table 2-13 Summary of I/O
Table notes were added in connection with this data.
The temperature was revised from 110C to 100C in Table 2-31 Duration of
Characteristics" sectionwere revised to include 3.3 V LVCMOS and 1.2 V
LVCMOS wide range.
Most tables were updated in the following sections, revising existing values and
adding information for 3.3 V and 1.2 V wide range:
The value for "Delay range in block: fixed delay" was revised in Table 2-143
The timing characteristics tables for RAM4K9 and RAM512X18 were updated,
including renaming of the address collision parameters.
Revision 7 (Apr 2009)
Product Brief v1.4
DC
and
Switching
Characteristics
Advance v0.4
The –F speed grade is no longer offered for IGLOOe devices and was removed
from the documentation. The speed grade column and note regarding –F speed
grade were removed from "IGLOOe Ordering Information". The "Speed Grade
and Temperature Grade Matrix" section was removed.
III, IV
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AGLE3000V2-FG896PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE3000V2-FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V2-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V2-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V2-FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology