参数资料
型号: ATF-501P8-TR1
元件分类: 小信号晶体管
英文描述: L BAND, Si, N-CHANNEL, RF SMALL SIGNAL, HEMFET, MO-229
封装: 2 x 2 MM, 0.75 MM HEIGHT,LEAD FREE, PLASTIC,LPCC-8
文件页数: 12/22页
文件大小: 786K
代理商: ATF-501P8-TR1
2
ATF-501P8 Absolute Maximum Ratings[1]
Absolute
Symbol
Parameter
Units
Maximum
VDS
Drain–Source Voltage[2]
V
7
VGS
Gate–Source Voltage[2]
V
-5 to 0.8
VGD
Gate Drain Voltage[2]
V
-5 to 1
IDS
Drain Current[2]
A
1
IGS
Gate Current
mA
12
Pdiss
Total Power Dissipation[3]
W
3.5
Pin max.
RF Input Power
dBm
30
TCH
Channel Temperature
°C
150
TSTG
Storage Temperature
°C
-65 to 150
θch_b
Thermal Resistance[4]
°C/W
23
Notes:
1. Operation of this device in excess of
any one of these parameters may cause
permanent damage.
2. Assumes DC quiescent conditions.
3. Board (package belly) temperatureTB is
25°C. Derate 43.5 mW/°C for TB > 69.5°C.
4. Channel-to-board
thermal
resistance
measured using 150°C Liquid Crystal
Measurement method.
Notes:
5. Distribution data sample size is 300 samples taken from 3 different wafers and 3 different lots. Future wafers allocated to this product may have
nominal values anywhere between the upper and lower limits.
6. Measurements are made on production test board, which represents a trade-off between optimal OIP3, P1dB and VSWR. Circuit losses have
been de-embedded from actual measurements.
Figure 1. Typical IV curve (Vgs = 0.01V) per step.
Vds (V)
Ids
(mA)
0
6
1
2
3
4
5
800
700
600
500
400
300
200
100
0
Vgs=0.6V
Vgs=0.55V
Vgs=0.5V
Vgs=0.7V
Vgs=0.65V
Product Consistency Distribution Charts at 2 GHz, 4.5V, 200 mA[5,6]
Figure 2. P1dB.
P1dB (dBm)
27.5
30.5
28
28.5
29
29.5
30
120
100
80
60
40
20
0
Cpk=1.76
Stdev=0.3
+3 Std
–3 Std
Figure 3. PAE.
PAE (%)
45
85
55
65
75
120
100
80
60
40
20
0
Cpk=1.51
Stdev=3.38
+3 Std
–3 Std
Figure 4. Gain.
GAIN (dB)
13
17
14
15
16
100
80
60
40
20
0
Cpk=1.61
Stdev=0.33
+3 Std
–3 Std
Figure 5. OIP3.
OIP3 (dBm)
42
50
43
44
45
46
47
48
49
100
80
60
40
20
0
Cpk=1.1
Stdev=0.87
+3 Std
–3 Std
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