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参数资料
| 型号： | ISP1160BD/01,118 |
| 厂商： | ST-ERICSSON |
| 元件分类： | 总线控制器 |
| 英文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PQFP64 |
| 封装： | 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64 |
| 文件页数： | 85/88页 |
| 文件大小： | 394K |
| 代理商： | ISP1160BD/01,118 |
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Philips Semiconductors
ISP1160
Embedded USB Host Controller
Product data
Rev. 05 — 24 December 2004
86 of 88
9397 750 13963
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex
foil by using a hot bar soldering process. The appropriate soldering prole can be provided on
request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
22. Revision history
Table 77:
Revision history
Rev Date
CPCN
Description
05
20041224 200412019
Product data (9397 750 13963)
Modications:
Figure 2 “Pin conguration LQFP64.”: added a gure note.
Table 2 “Pin description LQFP64”: in the description for pin 60, changed address A1 to
A2.
Section 9.8.1 “Using an internal OC detection circuit”: fourth paragraph, second
sentence, changed source to drain and drain to source.
04
20030704 -
Product data (9397 750 11371)
03
20030227 -
Product data (9397 750 10765)
02
20020912 -
Product data (9397 750 09628)
01
20020104 -
Objective data (9397 750 09161)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISP1160BD01FA | 功能描述:IC USB HOST CONTROLLER 64LQFP RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:4,900 系列:- 控制器类型:USB 2.0 控制器 接口:串行 电源电压:3 V ~ 3.6 V 电流 - 电源:135mA 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:36-VFQFN 裸露焊盘 供应商设备封装:36-QFN（6x6） 包装:* 其它名称:Q6396337A |
| ISP1160BD01-S | 功能描述:USB 接口集成电路 USB FULL SPEED HOST RoHS:否 制造商:Cypress Semiconductor 产品:USB 2.0 数据速率: 接口类型:SPI 工作电源电压:3.15 V to 3.45 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:WLCSP-20 |
| ISP1160BD01-T | 功能描述:USB 接口集成电路 USB HOST CTRL FULL-SPD RoHS:否 制造商:Cypress Semiconductor 产品:USB 2.0 数据速率: 接口类型:SPI 工作电源电压:3.15 V to 3.45 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:WLCSP-20 |
| ISP1160BD01TM | 功能描述:IC USB HOST CTRL FULL-SPD 64LQFP RoHS:是 类别:集成电路 (IC) >> 接口 - 控制器 系列:- 标准包装:4,900 系列:- 控制器类型:USB 2.0 控制器 接口:串行 电源电压:3 V ~ 3.6 V 电流 - 电源:135mA 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:36-VFQFN 裸露焊盘 供应商设备封装:36-QFN（6x6） 包装:* 其它名称:Q6396337A |
| ISP1160BM | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
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