参数资料
型号: LFXP15C-4FN256C
厂商: LATTICE SEMICONDUCTOR CORP
元件分类: FPGA
中文描述: FPGA, 1932 CLBS, PBGA256
封装: 17 X 17 MM, LEAD FREE, FPBGA-256
文件页数: 2/130页
文件大小: 1312K
代理商: LFXP15C-4FN256C
2-7
Architecture
Lattice Semiconductor
LatticeXP Family Data Sheet
Figure 2-5. Primary Clock Sources
Secondary Clock Sources
LatticeXP devices have four secondary clock resources per quadrant. The secondary clock branches are tapped at
every PFU. These secondary clock networks can also be used for controls and high fanout data. These secondary
clocks are derived from four clock input pads and 16 routing signals as shown in Figure 2-6.
From Routing
Clock Input
From Routing
PLL Input
Clock Input
PLL Input
Clock Input
PLL Input
From Routing
Clock Input
From Routing
PLL
20 Primary Clock Sources
To Quadrant Clock Selection
Note: Smaller devices have two PLLs.
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相关代理商/技术参数
参数描述
LFXP15C-4FN256I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 188 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN388C 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 268 IO 1. 8/2.5/3.3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN388I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 268 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN484C 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 1.8/2.5/3 .3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN484I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 1.8/2.5/3 .3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256