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参数资料
型号： LFXP15C-4FN256C
厂商： LATTICE SEMICONDUCTOR CORP
元件分类： FPGA
中文描述： FPGA, 1932 CLBS, PBGA256
封装： 17 X 17 MM, LEAD FREE, FPBGA-256
文件页数： 34/130页
文件大小： 1312K
代理商： LFXP15C-4FN256C
November 2007
Data Sheet DS1001
2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
7-1
Revision History
Date
Version
Section
Change Summary
February 2005
01.0
—
Initial release.
April 2005
01.1
Architecture
EBR memory support section updated with clarification.
May 2005
01.2
Introduction
Added TransFR Reconfiguration to Features section.
Architecture
Added TransFR section.
June 2005
01.3
Pinout Information
Added pinout information for LFXP3, LFXP6, LFXP15 and LFXP20.
July 2005
02.0
Introduction
Updated XP6, XP15 and XP20 EBR SRAM Bits and Block numbers.
Architecture
Updated Per Quadrant Primary Clock Selection figure.
Added Typical I/O Behavior During Power-up section.
Updated Device Configuration section under Configuration and Testing.
DC and Switching
Characteristics
Clarified Hot Socketing Specification
Updated Supply Current (Standby) Table
Updated Initialization Supply Current Table
Added Programming and Erase Flash Supply Current table
Added LVDS Emulation section. Updated LVDS25E Output Termination
Example figure and LVDS25E DC Conditions table.
Updated Differential LVPECL diagram and LVPECL DC Conditions
table.
Deleted 5V Tolerant Input Buffer section. Updated RSDS figure and
RSDS DC Conditions table.
Updated sysCONFIG Port Timing Specifications
Updated JTAG Port Timing Specifications. Added Flash Download
Time table.
Pinout Information
Updated Signal Descriptions table.
Updated Logic Signal Connections Dual Function column.
Ordering Information
Added lead-free ordering part numbers.
July 2005
02.1
DC and Switching
Characteristics
Clarification of Flash Programming Junction Temperature
August 2005
02.2
Introduction
Added Sleep Mode feature.
Architecture
Added Sleep Mode section.
DC and Switching
Characteristics
Added Sleep Mode Supply Current Table
Added Sleep Mode Timing section
Pinout Information
Added SLEEPN and TOE signal names, descriptions and footnotes.
Added SLEEPN and TOE to pinout information and footnotes.
Added footnote 3 to Logic Signal Connections tables for clarification on
emulated LVDS output.
September 2005
03.0
Architecture
Added clarification of PCI clamp.
Added clarification to SLEEPN Pin Characteristics section.
DC and Switching
Characteristics
DC Characteristics, added footnote 4 for clarification. Updated Supply
Current (Sleep Mode), Supply Current (Standby), Initialization Supply
Current, and Programming and Erase Flash Supply Current typical
numbers.
LatticeXP Family Data Sheet
Revision History
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相关代理商/技术参数
参数描述
LFXP15C-4FN256I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 188 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN388C 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 268 IO 1. 8/2.5/3.3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN388I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 268 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN484C 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 1.8/2.5/3 .3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN484I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 1.8/2.5/3 .3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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