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参数资料
型号： LFXP15C-4FN256C
厂商： LATTICE SEMICONDUCTOR CORP
元件分类： FPGA
中文描述： FPGA, 1932 CLBS, PBGA256
封装： 17 X 17 MM, LEAD FREE, FPBGA-256
文件页数： 52/130页
文件大小： 1312K
代理商： LFXP15C-4FN256C
2-25
Architecture
Lattice Semiconductor
LatticeXP Family Data Sheet
Table 2-8. Supported Output Standards
Hot Socketing
The LatticeXP devices have been carefully designed to ensure predictable behavior during power-up and power-
down. Power supplies can be sequenced in any order. During power up and power-down sequences, the I/Os
remain in tristate until the power supply voltage is high enough to ensure reliable operation. In addition, leakage
into I/O pins is controlled to within specified limits, which allows easy integration with the rest of the system.
These capabilities make the LatticeXP ideal for many multiple power supply and hot-swap applications.
Sleep Mode
The LatticeXP “C” devices (VCC = 1.8/2.5/3.3V) have a sleep mode that allows standby current to be reduced by up
to three orders of magnitude during periods of system inactivity. Entry and exit to Sleep Mode is controlled by the
SLEEPN pin.
During Sleep Mode, the FPGA logic is non-operational, registers and EBR contents are not maintained and I/Os
are tri-stated. Do not enter Sleep Mode during device programming or configuration operation. In Sleep Mode,
power supplies can be maintained in their normal operating range, eliminating the need for external switching of
power supplies. Table 2-9 compares the characteristics of Normal, Off and Sleep Modes.
Output Standard
Drive
VCCIO (Nom.)
Single-ended Interfaces
LVTTL
4mA, 8mA, 12mA, 16mA, 20mA
3.3
LVCMOS33
4mA, 8mA, 12mA 16mA, 20mA
3.3
LVCMOS25
4mA, 8mA, 12mA 16mA, 20mA
2.5
LVCMOS18
4mA, 8mA, 12mA 16mA
1.8
LVCMOS15
4mA, 8mA
1.5
LVCMOS12
2mA, 6mA
1.2
LVCMOS33, Open Drain
4mA, 8mA, 12mA 16mA, 20mA
—
LVCMOS25, Open Drain
4mA, 8mA, 12mA 16mA, 20mA
—
LVCMOS18, Open Drain
4mA, 8mA, 12mA 16mA
—
LVCMOS15, Open Drain
4mA, 8mA
—
LVCMOS12, Open Drain
2mA. 6mA
—
PCI33
N/A
3.3
HSTL18 Class I, II, III
N/A
1.8
HSTL15 Class I, III
N/A
1.5
SSTL3 Class I, II
N/A
3.3
SSTL2 Class I, II
N/A
2.5
SSTL18 Class I
N/A
1.8
Differential Interfaces
Differential SSTL3, Class I, II
N/A
3.3
Differential SSTL2, Class I, II
N/A
2.5
Differential SSTL18, Class I
N/A
1.8
Differential HSTL18, Class I, II, III
N/A
1.8
Differential HSTL15, Class I, III
N/A
1.5
LVDS
N/A
2.5
BLVDS
1
N/A
2.5
LVPECL
1
N/A
3.3
1. Emulated with external resistors.
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相关代理商/技术参数
参数描述
LFXP15C-4FN256I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 188 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN388C 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 268 IO 1. 8/2.5/3.3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN388I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 268 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN484C 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 1.8/2.5/3 .3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN484I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 1.8/2.5/3 .3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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