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参数资料
型号： LFXP15C-4FN256C
厂商： LATTICE SEMICONDUCTOR CORP
元件分类： FPGA
中文描述： FPGA, 1932 CLBS, PBGA256
封装： 17 X 17 MM, LEAD FREE, FPBGA-256
文件页数： 50/130页
文件大小： 1312K
代理商： LFXP15C-4FN256C
2-23
Architecture
Lattice Semiconductor
LatticeXP Family Data Sheet
Figure 2-28. LatticeXP Banks
LatticeXP devices contain two types of sysIO buffer pairs.
1.
Top and Bottom sysIO Buffer Pair (Single-Ended Outputs Only)
The sysIO buffer pairs in the top and bottom banks of the device consist of two single-ended output drivers and
two sets of single-ended input buffers (both ratioed and referenced). The referenced input buffer can also be
configured as a differential input.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
Only the I/Os on the top and bottom banks have PCI clamps. Note that the PCI clamp is enabled after VCC,
VCCAUX and VCCIO are at valid operating levels and the device has been configured.
2.
Left and Right sysIO Buffer Pair (Differential and Single-Ended Outputs)
The sysIO buffer pairs in the left and right banks of the device consist of two single-ended output drivers, two
sets of single-ended input buffers (both ratioed and referenced) and one differential output driver. The refer-
enced input buffer can also be configured as a differential input. In these banks the two pads in the pair are
described as “true” and “comp”, where the true pad is associated with the positive side of the differential I/O,
and the comp (complementary) pad is associated with the negative side of the differential I/O.
Select I/Os in the left and right banks have LVDS differential output drivers. Refer to the Logic Signal Connec-
tions tables for more information.
V
REF1(2)
GND
Bank
2
V
CCIO2
V
REF2(2)
V
REF1(3)
GND
Bank
3
V
CCIO3
V
REF2(3)
V
REF1(7)
GND
Bank
7
V
CCIO7
V
REF2(7)
V
REF1(6)
GND
Note: N and M are the maximum number of I/Os per bank.
Bank
6
V
CCIO6
V
REF2(6)
V
REF1(5)
GND
Bank 5
V
CCIO5
V
REF2(5)
V
REF1(4)
GND
Bank 4
V
CCIO4
V
REF2(4)
V
REF1(
0)
GND
Bank 0
V
CCIO0
V
REF2(
0)
V
REF1(1)
GND
Bank 1
V
CCIO1
V
REF2(1)
1
M
1
M
1
M
1
M
1N
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相关代理商/技术参数
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LFXP15C-4FN256I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 188 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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LFXP15C-4FN388I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 268 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN484C 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 1.8/2.5/3 .3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
LFXP15C-4FN484I 功能描述:FPGA - 现场可编程门阵列 15.4K LUTs 1.8/2.5/3 .3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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