参数资料
型号: MC8640DHX1250HE
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
封装: 33 X 33 MM, CERAMIC, FCBGA-1023
文件页数: 18/130页
文件大小: 1495K
代理商: MC8640DHX1250HE
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
114
Freescale Semiconductor
Thermal
The thermal model uses approximate dimensions to reduce grid. Please refer to the case outline for actual
dimensions.
Figure 62. Recommended Thermal Model of MPC8640
19.2.4
Temperature Diode
The MPC8640 has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature of
the microprocessor and its environment. For proper operation, the monitoring device used should
auto-calibrate the device by canceling out the VBE variation of each MPC8640’s internal diode.
The following are the specifications of the MPC8640 on-board temperature diode:
Vf > 0.40 V
Vf < 0.90 V
Operating range 2–300
μA
Diode leakage < 10 nA at 125
°C
Ideality factor over 5–150
μA at 60 °C: n = 1.0275 ± 0.9%
Bump and Underfill
Die
Substrate
C5 solder layer
Die
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Die (12.4
× 15.3 × 0.86 mm)
Silicon
Temperature
dependent
Bump and Underfill (12.4
× 15.3 × 0.07 mm)
Collapsed Resistance
kz
5.3
W/(m K)
Substrate (33
× 33 × 1.2 mm)
kx
13.5
W/(m K)
ky
13.5
kz
5.3
C5 Solder layer (33
× 33 × 0.4 mm)
kx
0.034
W/(m K)
ky
0.034
kz
9.6
相关PDF资料
PDF描述
MC8640DHX1067NC 32-BIT, 1067 MHz, MICROPROCESSOR, CBGA1023
MC8640DTVU1000HE 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA1023
MC8640DTHX1067NC 32-BIT, 1067 MHz, MICROPROCESSOR, CBGA1023
MC8640THX1250HC 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
MC8640DTVU1250HE 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
相关代理商/技术参数
参数描述
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