参数资料
型号: MC8640DHX1250HE
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
封装: 33 X 33 MM, CERAMIC, FCBGA-1023
文件页数: 22/130页
文件大小: 1495K
代理商: MC8640DHX1250HE
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
118
Freescale Semiconductor
System Design Information
designer place at least one decoupling capacitor at each OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren,
and VDD_PLAT pin of the device. These decoupling capacitors should receive their power from separate
OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and VDD_PLAT and GND power planes in the PCB,
utilizing short traces to minimize inductance. Capacitors may be placed directly under the device using a
standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and VDD_PLAT planes, to enable quick
recharging of the smaller chip capacitors. They should also be connected to the power and ground planes
through two vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum
or Sanyo OSCON).
20.4
SerDes Block Power Supply Decoupling Recommendations
The SerDes block requires a clean, tightly regulated source of power (SVDD and XVDD_SRDSn) to ensure
low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is
outlined below.
Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections
from all capacitors to power and ground should be done with multiple vias to further reduce inductance.
First, the board should have at least 10
× 10-nF SMT ceramic chip capacitors as close as possible
to the supply balls of the device. Where the board has blind vias, these capacitors should be placed
directly below the chip supply and ground connections. Where the board does not have blind vias,
these capacitors should be placed in a ring around the device as close to the supply and ground
connections as possible.
Second, there should be a 1-F ceramic chip capacitor on each side of the device. This should be
done for all SerDes supplies.
Third, between the device and any SerDes voltage regulator there should be a 10-F, low
equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-F, low ESR SMT
tantalum chip capacitor. This should be done for all SerDes supplies.
20.5
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. In general all unused active low inputs should be tied to OVDD, Dn_GVDD, LVDD, TVDD,
VDD_Coren, and VDD_PLAT, XVDD_SRDSn, and SVDD as required and unused active high inputs should
be connected to GND. All NC (no-connect) signals must remain unconnected.
The following list explains the special cases:
DDR—If one of the DDR ports is not being used the power supply pins for that port can be
connected to ground so that there is no need to connect the individual unused inputs of that port to
ground. Note that these power supplies can only be powered up again at reset for functionality to
occur on the DDR port. Power supplies for other functional buses should remain powered.
相关PDF资料
PDF描述
MC8640DHX1067NC 32-BIT, 1067 MHz, MICROPROCESSOR, CBGA1023
MC8640DTVU1000HE 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA1023
MC8640DTHX1067NC 32-BIT, 1067 MHz, MICROPROCESSOR, CBGA1023
MC8640THX1250HC 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
MC8640DTVU1250HE 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
相关代理商/技术参数
参数描述
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