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| 型号： | MSC8112TMP2400V |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 数字信号处理 |
| 英文描述： | OTHER DSP, PBGA431 |
| 封装： | 20 X 20 MM, PLASTIC, BGA-431 |
| 文件页数： | 35/44页 |
| 文件大小： | 1097K |
| 代理商： | MSC8112TMP2400V |
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MSC8112 Dual Core Digital Signal Processor Data Sheet, Rev. 1
Ordering Information
Freescale Semiconductor
40
3.5
Thermal Considerations
An estimation of the chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (R
θJA × PD)
Eqn. 1
where
TA = ambient temperature near the package (°C)
R
θJA = junction-to-ambient thermal resistance (°C/W)
PD = PINT + PI/O = power dissipation in the package (W)
PINT = IDD × VDD = internal power dissipation (W)
PI/O = power dissipated from device on output pins (W)
The power dissipation values for the MSC8112 are listed in Table 4. The ambient temperature for the device is the air
temperature in the immediate vicinity that would cool the device. The junction-to-ambient thermal resistances are JEDEC
standard values that provide a quick and easy estimation of thermal performance. There are two values in common usage: the
value determined on a single layer board and the value obtained on a board with two planes. The value that more closely
approximates a specific application depends on the power dissipated by other components on the printed circuit board (PCB).
The value obtained using a single layer board is appropriate for tightly packed PCB configurations. The value obtained using a
board with internal planes is more appropriate for boards with low power dissipation (less than 0.02 W/cm
2 with natural
convection) and well separated components. Based on an estimation of junction temperature using this technique, determine
whether a more detailed thermal analysis is required. Standard thermal management techniques can be used to maintain the
device thermal junction temperature below its maximum. If TJ appears to be too high, either lower the ambient temperature or
the power dissipation of the chip. You can verify the junction temperature by measuring the case temperature using a small
diameter thermocouple (40 gauge is recommended) or an infrared temperature sensor on a spot on the device case that is painted
black. The MSC8112 device case surface is too shiny (low emissivity) to yield an accurate infrared temperature measurement.
Use the following equation to determine TJ:
TJ = TT + (θJA × PD)
Eqn. 2
where
TT = thermocouple (or infrared) temperature on top of the package (°C)
θ
JA = thermal characterization parameter (°C/W)
PD = power dissipation in the package (W)
Note:
See MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601/D).
4
Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
Package Type
Core
Voltage
Operating
Temperature
Core
Frequency
(MHz)
Order Number
Lead-Free
Lead-Bearing
MSC8112
Flip Chip Plastic Ball Grid Array (FC-PBGA)
1.1 V
–40° to 105°C
300
MSC8112TVT2400V
MSC8112TMP2400V
相关PDF资料 |
PDF描述 |
|---|---|
| MSC81250M | L BAND, Si, NPN, RF POWER TRANSISTOR |
| MSC81250M | L BAND, Si, NPN, RF POWER TRANSISTOR |
| MSC81402 | L BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR |
| MSC81450M | L BAND, Si, NPN, RF POWER TRANSISTOR |
| MSC82010 | L BAND, Si, NPN, RF POWER TRANSISTOR |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MSC8112TVT2400V | 功能描述:DSP DUAL CORE 431-FCPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| MSC8112TVT2400V | 制造商:Freescale Semiconductor 功能描述:Dual Core Digital Signal Processor |
| MSC8113 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Tri-Core Digital Signal Processor |
| MSC8113TMP3600V | 功能描述:DSP TRI-CORE 431-FCPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| MSC8113TMP4800V | 功能描述:DSP TRI-CORE 431-FCPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
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