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| 型号： | MSC8112TMP2400V |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 数字信号处理 |
| 英文描述： | OTHER DSP, PBGA431 |
| 封装： | 20 X 20 MM, PLASTIC, BGA-431 |
| 文件页数： | 8/44页 |
| 文件大小： | 1097K |
| 代理商： | MSC8112TMP2400V |
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MSC8112 Dual Core Digital Signal Processor Data Sheet, Rev. 1
Electrical Characteristics
Freescale Semiconductor
16
The following sections include illustrations and tables of clock diagrams, signals, and parallel I/O outputs and inputs. When
systems such as DSP farms are developed using the DSI, use a device loading of 4 pF per pin. AC timings are based on a 20 pF
load, except where noted otherwise, and a 50
Ω transmission line. For loads smaller than 20 pF, subtract 0.06 ns per pF down
to 10 pF load. For loads larger than 20 pF, add 0.06 ns for SIU/Ethernet/DSI delay and 0.07 ns for GPIO/TDM/timer delay.
When calculating overall loading, also consider additional RC delay.
2.5.1
Output Buffer Impedances
2.5.2
Start-Up Timing
Starting the device requires coordination among several input sequences including clocking, reset, and power. Section 2.5.3
describes the clocking characteristics. Section 2.5.4 describes the reset and power-up characteristics. You must use the
following guidelines when starting up an MSC8112 device:
PORESET
and TRST must be asserted externally for the duration of the power-up sequence. See Table 11 for timing.
If possible, bring up the VDD and VDDH levels together. For designs with separate power supplies, bring up the VDD
CLKIN
should start toggling at least 16 cycles (starting after VDDH reaches its nominal level) before PORESET
CLKIN
must not be pulled high during VDDH power-up. CLKIN can toggle during this period.
Note:
See Section 3.1 for start-up sequencing recommendations and Section 3.2 for power supply design
recommendations.
The following figures show acceptable start-up sequence examples. Figure 6 shows a sequence in which VDD and VDDH are
raised together. Figure 7 shows a sequence in which VDDH is raised after VDD and CLKIN begins to toggle as VDDH rises.
Table 6. Output Buffer Impedances
Output Buffers
Typical Impedance (
Ω)
System bus
50
Memory controller
50
Parallel I/O
50
Note:
These are typical values at 65°C. The impedance may vary by ±25% depending on device process and operating temperature.
Figure 6. Start-Up Sequence: VDD and VDDH Raised Together
Vo
lt
a
g
e
Time
o.5 V
3.3 V
1.1 V
VDDH Nominal Level
PORESET/TRST Asserted
VDD Nominal Level
CLKIN Starts Toggling
VDD/VDDH Applied
PORESET/TRST Deasserted
1
2.2 V
VDDH = Nominal Value
VDD = Nominal Value
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相关代理商/技术参数 |
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| MSC8112TVT2400V | 功能描述:DSP DUAL CORE 431-FCPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| MSC8112TVT2400V | 制造商:Freescale Semiconductor 功能描述:Dual Core Digital Signal Processor |
| MSC8113 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Tri-Core Digital Signal Processor |
| MSC8113TMP3600V | 功能描述:DSP TRI-CORE 431-FCPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| MSC8113TMP4800V | 功能描述:DSP TRI-CORE 431-FCPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
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