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参数资料
| 型号： | MSC8112TMP2400V |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 数字信号处理 |
| 英文描述： | OTHER DSP, PBGA431 |
| 封装： | 20 X 20 MM, PLASTIC, BGA-431 |
| 文件页数： | 7/44页 |
| 文件大小： | 1097K |
| 代理商： | MSC8112TMP2400V |
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Electrical Characteristics
MSC8112 Dual Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
15
Table 5. DC Electrical Characteristics
Characteristic
Symbol
Min
Typical
Max
Unit
Input high voltage1, all inputs except CLKIN
VIH
2.0
—
3.465
V
Input low voltage1
VIL
GND
0
0.8
V
CLKIN input high voltage
VIHC
2.4
3.0
3.465
V
CLKIN input low voltage
VILC
GND
0
0.8
V
Input leakage current, VIN = VDDH
IIN
–1.0
0.09
1
A
Tri-state (high impedance off state) leakage current, VIN = VDDH
IOZ
–1.0
0.09
1
A
Signal low input current, VIL = 0.8 V
2
IL
–1.0
0.09
1
A
Signal high input current, VIH = 2.0 V
2
IH
–1.0
0.09
1
A
Output high voltage, IOH = –2 mA,
except open drain pins
VOH
2.0
3.0
—
V
Output low voltage, IOL= 3.2 mA
VOL
—0
0.4
V
VCCSYN PLL supply current
IVCCSYN
—2
4
mA
Internal supply current:
Wait mode
Stop mode
IDDW
IDDS
—
3753
2903
—
mA
Typical power 300 MHz at 1.1 V4
P—
554
—
mW
Notes:
1.
See Figure 5 for undershoot and overshoot voltages.
2.
Not tested. Guaranteed by design.
3.
Measured for 1.1 V core at 25°C junction temperature.
4.
The typical power values were calculated using a power calculator configured for two cores performing an EFR code with the
device running at the specified operating frequency and a junction temperature of 25°C. No peripherals were included. The
calculator was created using CodeWarrior 2.5. These values are provided as examples only. Power consumption is
application dependent and varies widely. To assure proper board design with regard to thermal dissipation and maintaining
proper operating temperatures, evaluate power consumption for your application and use the design guidelines in Section 3 of
this document and in MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601).
Figure 5. Overshoot/Undershoot Voltage for VIH and VIL
GND
GND – 0.3 V
GND – 0.7 V
VIL
VIH
Must not exceed 10% of clock period
VDDH + 17%
VDDH + 8%
VDDH
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| MSC8112TVT2400V | 功能描述:DSP DUAL CORE 431-FCPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| MSC8112TVT2400V | 制造商:Freescale Semiconductor 功能描述:Dual Core Digital Signal Processor |
| MSC8113 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Tri-Core Digital Signal Processor |
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| MSC8113TMP4800V | 功能描述:DSP TRI-CORE 431-FCPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:StarCore 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
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