参数资料
型号: MT46H256M32L4CM-54IT:A
元件分类: DRAM
英文描述: 256M X 32 DDR DRAM, 5 ns, PBGA90
封装: 10 X 13 MM, GREEN, PLASTIC, VFBGA-90
文件页数: 49/106页
文件大小: 3431K
Figure 19: READ Command
CS#
WE#
CAS#
RAS#
CKE
Column
Address
A10
BA0, BA1
HIGH
EN AP
DIS AP
Bank
CK
CK#
Don’t Care
Note: 1. EN AP = enable auto precharge; DIS AP = disable auto precharge.
WRITE
The WRITE command is used to initiate a burst write access to an active row. The val-
ues on the BA0 and BA1 inputs select the bank; the address provided on inputs A[I:0]
(where I = the most significant column address bit for each configuration) selects the
starting column location. The value on input A10 determines whether auto precharge is
used. If auto precharge is selected, the row being accessed will be precharged at the end
of the WRITE burst; if auto precharge is not selected, the row will remain open for subse-
quent accesses. Input data appearing on the DQ is written to the memory array, subject
to the DM input logic level appearing coincident with the data. If a given DM signal is
registered LOW, the corresponding data will be written to memory; if the DM signal is
registered HIGH, the corresponding data inputs will be ignored, and a WRITE will not
be executed to that byte/column location.
If a WRITE or a READ is in progress, the entire data burst must be complete prior to
stopping the clock (see Clock Change Frequency (page 104)). A burst completion for
WRITEs is defined when the write postamble and tWR or tWTR are satisfied.
2Gb: x16, x32 Mobile LPDDR SDRAM
Commands
PDF: 09005aef83a73286
2gb_ddr_mobile_sdram_t69m.pdf - Rev. M 11/10 EN
47
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2009 Micron Technology, Inc. All rights reserved.
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