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参数资料
| 型号： | ORT42G5-EV |
| 厂商： | Lattice Semiconductor Corporation |
| 文件页数： | 19/119页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL ORT42G5/CABLE/ADAPTER |
| 标准包装： | 1 |
| 系列： | ORCA® 4 系列 |
| 类型： | FPGA |
| 适用于相关产品： | ORT42G5 |
| 所含物品： | 板，线缆，电源 |
| 其它名称： | ORT42G5EV |
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Lattice Semiconductor
ORCA ORT42G5 and ORT82G5 Data Sheet
115
where TC is the case temperature at top dead center, TJ is the junction temperature, and Q is the chip power. Dur-
ing the ΘJA measurements described above, besides the other parameters measured, an additional temperature
reading, TC, is made with a thermocouple attached at top-dead-center of the case. ψJC is also expressed in units of
°C/W.
Θ
ΘJC
This is the thermal resistance from junction to case. It is most often used when attaching a heat sink to the top of
the package. It is dened by:
(3)
The parameters in this equation have been dened above. However, the measurements are performed with the
case of the part pressed against a water-cooled heat sink to draw most of the heat generated by the chip out the
top of the package. It is this difference in the measurement process that differentiates ΘJC from ψJC. ΘJC is a true
thermal resistance and is expressed in units of °C/W.
ΘJB
This is the thermal resistance from junction to board. It is dened by:
(4)
where TB is the temperature of the board adjacent to a lead measured with a thermocouple. The other parameters
on the right-hand side have been dened above. This is considered a true thermal resistance, and the measure-
ment is made with a water-cooled heat sink pressed against the board to draw most of the heat out of the leads.
Note that ΘJB is expressed in units of °C/W and that this parameter and the way it is measured are still being dis-
cussed by the JEDEC committee.
FPSC Maximum Junction Temperature
Once the power dissipated by the FPSC has been determined, the maximum junction temperature of the FPSC
can be found. This is needed to determine if speed derating of the device from the 85 °C junction temperature used
in all of the delay tables is needed. Using the maximum ambient temperature, TAmax, and the power dissipated by
the device, Q (expressed in °C), the maximum junction temperature is approximated by:
(5)
Package Thermal Characteristics
The thermal characteristics of the 484-ball PBGAM (fpBGA with heat spreader) used for the ORT42G5, the 680-
ball PBGAM (fpBGA with heat spreader) and the 680-ball fpBGA used for the ORT82G5 are available in the Ther-
mal Management section of the Lattice web site at www.latticesemi.com.
Heat Sink Vendors for BGA Packages
The estimated worst-case power requirements for the ORT42G5 and ORT82G5 are in the 3 W to 5 W range. Con-
sequently, for most applications an external heat sink will be required. Table 46 lists, in alphabetical order, heat sink
vendors who advertise heat sinks aimed at the BGA market.
ΘJC =
TJ – TC
Q
ΘJB =
TJ – TB
Q
TJmax = TAmax + (Q ΘJB)
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