参数资料
型号: RK80532KE056512
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 2400 MHz, MICROPROCESSOR, CPGA604
封装: FLIP CHIP, MICRO, PGA2-604
文件页数: 69/102页
文件大小: 1464K
代理商: RK80532KE056512
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
69
5.0
Thermal Specifications
This chapter provides the thermal specifications necessary for designing a thermal solution for the
Intel Xeon Processor with 533 MHz Front Side Bus. Thermal solutions should include
heatsinks that attach to the integrated heat spreader (IHS). The IHS provides a common interface
intended to be compatible with many heatsink designs. Thermal specifications are based on the
temperature of the IHS top, referred to as the case temperature, or TCASE. Thermal solutions should
be designed to maintain the processor within TCASE specifications. For information on performing
TCASE measurements, refer to the Intel Xeon Processor Thermal Design Guidelines. See Figure
18 for an exploded view of the processor package and thermal solution assembly.
Note:
The processor is either shipped alone or with a heatsink (boxed processor only). All other
components shown in Figure 18 must be purchased separately.
Note:
This is a graphical representation. For specifications, see each component’s respective
documentation listed in Section 1.3.
Figure 18. Processor with Thermal and Mechanical Components - Exploded View
604 P in
相关PDF资料
PDF描述
BX80532KE3060D 3060 MHz, MICROPROCESSOR, XMA
BX80532KE2400DU 2400 MHz, MICROPROCESSOR, XMA604
RK80532PG072512 2800 MHz, MICROPROCESSOR, PGA478
RK80532RC049128 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478
RK80532RC056128 2400 MHz, MICROPROCESSOR, CPGA478
相关代理商/技术参数
参数描述
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