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参数资料
| 型号： | RK80532KE056512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2400 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO, PGA2-604 |
| 文件页数： | 92/102页 |
| 文件大小： | 1464K |
| 代理商： | RK80532KE056512 |
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Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
9
Central Agent - The central agent is the host bridge to the processor and is typically known as
the chipset.
Flip Chip Ball Grid Array (FC-BGA) - Microprocessor packaging using “flip chip” design,
where the processor is attached to the substrate face-down for better signal integrity, more
efficient heat removal and lower inductance.
FC-mPGA2 - Packaging technology with the processor die mounted directly to a micro-Pin
Grid Array substrate with an integrated heat spreader (IHS).
Front Side Bus - Front Side Bus (FSB) is the electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All memory and
I/O transactions as well as interrupt messages pass between the processor and chipset over the
FSB.
Intel Xeon processor with 512 KB L2 cache - The entire processor in its INT-mPGA
package, including processor core in its FC-BGA package, integrated heat spreader (IHS), and
interposer.
Intel Xeon processor with 533 MHz Front Side Bus - The entire processor in its FC-
mPGA2 package, including processor core in its FC-BGA package, integrated heat spreader
(IHS), and interposer.
Integrated Heat Spreader (IHS) - The surface used to attach a heatsink or other thermal
solution to the processor.
Interposer - The structure on which the processor core package and I/O pins are mounted.
OEM - Original Equipment Manufacturer.
Processor core - The processor’s execution engine. All AC timing and signal integrity
specifications are to the pads of the processor core.
Retention mechanism - The support components that are mounted through the baseboard to
the chassis to provide mechanical retention for the processor and heatsink assembly.
Symmetric Agent - A symmetric agent is a processor which shares the same I/O subsystem
and memory array, and runs the same operating system as another processor in a system.
Systems using symmetric agents are known as Symmetric Multiprocessing (SMP) systems.
Intel Xeon (DP - Dual Processor) processors should only be used in SMP systems which
have two or fewer symmetric agents.
1.2
State of Data
The data contained in this document is subject to change. It is the best information that Intel is able
to provide at the publication date of this document.
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PDF描述 |
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| BX80532KE3060D | 3060 MHz, MICROPROCESSOR, XMA |
| BX80532KE2400DU | 2400 MHz, MICROPROCESSOR, XMA604 |
| RK80532PG072512 | 2800 MHz, MICROPROCESSOR, PGA478 |
| RK80532RC049128 | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
| RK80532RC056128 | 2400 MHz, MICROPROCESSOR, CPGA478 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532KE056512S L6GD | 功能描述:IC XEON 2.4GHZ INT-MPGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE056512S L6VL | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:PRESTONIA; MPU XEON NETBURST 64BIT 0.13UM 2.4GHZ 604PIN - Trays |
| RK80532KE056512S L72D | 制造商:Intel 功能描述:MPU Xeon? Processor 64-Bit 0.13um 2.4GHz 604-Pin FCPGA |
| RK80532KE056512SL73L | 功能描述:IC XEON 2.4GHZ 604FC-MPGA-2P RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE067512 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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