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参数资料
| 型号： | RK80532KE056512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2400 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO, PGA2-604 |
| 文件页数： | 84/102页 |
| 文件大小： | 1464K |
| 代理商： | RK80532KE056512 |
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82
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
7.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor passive heatsink and
the PWT.
Proper clearance is required around the heatsink to ensure proper installation of the processor and
unimpeded airflow for proper cooling.
7.2.1
Boxed Processor Heatsink Dimensions
The boxed processor is shipped with an unattached passive heatsink. Clearance is required around
the heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and
dimensions for the boxed processor with assembled heatsink are shown in Figure 26 (Multiple
Views). The airflow requirements for the boxed processor heatsink must also be taken into
consideration when designing new baseboards and chassis. The airflow requirements are detailed
in the Thermal Specifications, Section 7.4.
7.2.2
Boxed Processor Heatsink Weight
The boxed processor heatsink weighs no more than 450 grams. See Chapter 3.0 and Chapter 5.0 of
this document along with the Intel XeonTM Processor Family Thermal Design Guidelines for
details on the processor weight and heatsink requirements.
7.2.3
Boxed Processor Retention Mechanism and Heatsink Supports
The boxed processor requires processor retention solution to secure the processor, the baseboard,
and the chassis. The retention solution contains one retention mechanisms and two retention clips
per processor. The boxed processor ships with retention mechanism, cooling solution retention
clips, and direct chassis attach screws.Baseboards and chassis designed for use by system integra-
tors should include holes that are in proper alignment with each other to support the boxed proces-
sor. Refer to the Server System Infrastructure Specification (SSI-EEB) at http://www.ssiforum.org
for details on the hole locations. Please refer to the “Boxed integration notes” at http://sup-
port.intel.com/support/processors/xeon for retention mechanism installation instructions. Retention
mechanism clips must interface with the boxed processor heatsink area shown in Detail A in Figure
The retention mechanism that ships with the boxed processor is different than the reference solu-
tion from Intel. Please refer to Figure 24 below, which contains the dimensions for the reference
solution. Please refer to Figure 25 for the retention mechanism that ships with the boxed processor.
相关PDF资料 |
PDF描述 |
|---|---|
| BX80532KE3060D | 3060 MHz, MICROPROCESSOR, XMA |
| BX80532KE2400DU | 2400 MHz, MICROPROCESSOR, XMA604 |
| RK80532PG072512 | 2800 MHz, MICROPROCESSOR, PGA478 |
| RK80532RC049128 | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
| RK80532RC056128 | 2400 MHz, MICROPROCESSOR, CPGA478 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532KE056512S L6GD | 功能描述:IC XEON 2.4GHZ INT-MPGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE056512S L6VL | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:PRESTONIA; MPU XEON NETBURST 64BIT 0.13UM 2.4GHZ 604PIN - Trays |
| RK80532KE056512S L72D | 制造商:Intel 功能描述:MPU Xeon? Processor 64-Bit 0.13um 2.4GHz 604-Pin FCPGA |
| RK80532KE056512SL73L | 功能描述:IC XEON 2.4GHZ 604FC-MPGA-2P RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE067512 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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