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参数资料
| 型号： | RK80532KE056512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2400 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO, PGA2-604 |
| 文件页数： | 88/102页 |
| 文件大小： | 1464K |
| 代理商： | RK80532KE056512 |
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86
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
7.3
Boxed Processor Requirements
7.3.1
Intel Xeon Processor with 533 MHz Front Side Bus
7.3.1.1
Processor Wind Tunnel
The boxed processor ships with an active duct cooling solution called the Processor Wind Tunnel,
or PWT. This is an optional cooling solution that is designed to meet the thermal requirements of a
diverse combination of baseboards and chassis. It ships with the processor in order to reduce the
burden on the chassis manufacturer to provide adequate airflow across the processor heatsink.
Manufacturers may elect to use their own cooling solution.
Note:
Although Intel will be testing a select number of baseboard and chassis combinations for thermal
compliance, this is in no way a comprehensive test. It is ultimately the system integrator’s
responsibility to test that their solution meets all of the requirements specified in this document.
The PWT is meant to assist in processor cooling, but additional cooling techniques may be required
in order to ensure that the entire system meets the thermal requirements.
7.3.1.2
Fan Power Supply
The Processor Wind Tunnel includes a fan, which requires a constant +12V power supply. A fan
power cable is shipped with the boxed processor to draw power from a power header on the
baseboard. The power cable connector and pinouts are shown in Figure 27 and the fan cable
connector requirements are detailed in Table 46. Platforms must provide a matched power header
to support the boxed processor. Table 47 contains specifications for the input and output signals at
the fan heatsink connector. The fan heatsink outputs a SENSE signal, an open-collector output, that
pulses at a rate of two pulses per fan revolution. A baseboard pull-up resistor provides VOH to
match the baseboard-mounted fan speed monitor requirements, if applicable. Use of the SENSE
signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the platform
documentation, or on the baseboard itself. The baseboard power header should be positioned
within 7 inches from the centre of the processor socket.
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| RK80532PG072512 | 2800 MHz, MICROPROCESSOR, PGA478 |
| RK80532RC049128 | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532KE056512S L6GD | 功能描述:IC XEON 2.4GHZ INT-MPGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE056512S L6VL | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:PRESTONIA; MPU XEON NETBURST 64BIT 0.13UM 2.4GHZ 604PIN - Trays |
| RK80532KE056512S L72D | 制造商:Intel 功能描述:MPU Xeon? Processor 64-Bit 0.13um 2.4GHz 604-Pin FCPGA |
| RK80532KE056512SL73L | 功能描述:IC XEON 2.4GHZ 604FC-MPGA-2P RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE067512 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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