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参数资料
| 型号： | RK80532KE056512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2400 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO, PGA2-604 |
| 文件页数： | 79/102页 |
| 文件大小： | 1464K |
| 代理商： | RK80532KE056512 |
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Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
Once in the Sleep state, the SLP# pin can be deasserted if another asynchronous front side bus
event occurs. The SLP# pin should only be asserted when the processor (and all logical processors
within the physical processor) is in the Stop-Grant state. SLP# assertions while the processors are
not in the Stop-Grant state is out of specification and may result in illegal operation.
6.2.6
Bus Response During Low Power States
While in AutoHALT Power Down and Stop-Grant states, the processor will process a front side bus
snoop.
When the processor is in Sleep state, the processor will not process interrupts or snoop
transactions.
6.3
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the Thermal
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption by modulating (starting and stopping) the internal
processor core clocks. The Thermal Monitor feature must be enabled for the processor to be
operating within specifications. The temperature at which Thermal Monitor activates the thermal
control circuit is not user configurable and is not software visible. Bus traffic is snooped in the
normal manner, and interrupt requests are latched (and serviced during the time that the clocks are
on) while the TCC is active.
When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e. TCC is
active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle
specific to the processor (typically 30-50%). Clocks often will not be off for more than 3.0
microseconds when the TCC is active. Cycle times are processor speed dependent and will
decrease as processor core frequencies increase. A small amount of hysteresis has been included to
prevent rapid active/inactive transitions of the TCC when the processor temperature is near its
maximum operating temperature. Once the temperature has dropped below the maximum
operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock
modulation ceases.
With a properly designed and characterized thermal solution, it is anticipated that the TCC would
only be activated for very short periods of time when running the most power intensive
applications. The processor performance impact due to these brief periods of TCC activation is
expected to be so minor that it would be immeasurable. An under-designed thermal solution that is
not able to prevent excessive activation of the TCC in the anticipated ambient environment may
cause a noticeable performance loss, and in some cases may result in a TC that exceeds the
specified maximum temperature and may affect the long-term reliability of the processor. In
addition, a thermal solution that is significantly under-designed may not be capable of cooling the
processor even when the TCC is active continuously. Refer to the Intel Xeon Processor Thermal
Design Guidelines for information on designing a thermal solution.
The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and
cannot be modified. The Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532KE056512S L6GD | 功能描述:IC XEON 2.4GHZ INT-MPGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE056512S L6VL | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:PRESTONIA; MPU XEON NETBURST 64BIT 0.13UM 2.4GHZ 604PIN - Trays |
| RK80532KE056512S L72D | 制造商:Intel 功能描述:MPU Xeon? Processor 64-Bit 0.13um 2.4GHz 604-Pin FCPGA |
| RK80532KE056512SL73L | 功能描述:IC XEON 2.4GHZ 604FC-MPGA-2P RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE067512 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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