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| 型号： | STPCE1EEBC |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 外设及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PBGA388 |
| 封装： | PLASTIC, BGA-388 |
| 文件页数： | 75/87页 |
| 文件大小： | 1426K |
| 代理商： | STPCE1EEBC |
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DESIGN GUIDELINES
Release 1.3 - January 29, 2002
77/87
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
6.4.4. THERMAL DISSIPATION
6.4.4.1. Power saving
Thermal dissipation of the STPC depends mainly
on supply voltage. When the system does not
need to work at the upper voltage limit, it may
therefore be beneficial to reduce the voltage to the
lower voltage limit, where possible. This could
save a few 100’s of mW.
The second area to look at is unused interfaces
and functions. Depending on the application,
some input signals can be grounded, and some
blocks not powered or shutdown. Clock speed
dynamic adjustment is also a solution that can be
used
along
with
the
integrated
power
management unit.
6.4.4.2. Thermal balls
The standard way to route thermal balls to ground
layer implements only one via pad for each ball
pad, connected using a 8-mil wire.
With such configuration the Plastic BGA package
does 90% of the thermal dissipation through the
ground balls, and especially the central thermal
balls which are directly connected to the die. The
remaining 10% is dissipated through the case.
Adding a heat sink reduces this value to 85%.
As a result, some basic rules must be followed
when routing the STPC in order to avoid thermal
problems.
As the whole ground layer acts as a heat sink, the
ground balls must be directly connected to it, as
illustrated in Figure 6-24. If one ground layer is not
enough, a second ground plane may be added.
When possible, it is important to avoid other
devices
on-board
using
the
PCB
for
heat
dissipation, like linear regulators, as this would
heat the STPC itself and reduce the temperature
range of the whole system, In case these devices
can not use a separate heat sink, they must not be
located just near the STPC
Figure 6-24. Ground routing
Pad for ground ball
Thru hole to ground layer
Top
Lay
er :
Sign
als
Pow
er la
yer
Inte
rna
l lay
er:
sign
als
Bott
om
Lay
er :
grou
nd
laye
r
Note: For better visibility, ground balls are not all routed.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| STPCE1EEBI | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBC | 制造商:STMicroelectronics 功能描述:X86 GENERAL PURPOSE CONTROLLER - Bulk |
| STPCE1HDBI | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Microprocessor |
| STPCE1HEBC | 功能描述:微处理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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