- 您现在的位置：买卖IC网 > PDF目录69397 > STPCE1EEBC (STMICROELECTRONICS) MULTIFUNCTION PERIPHERAL, PBGA388 PDF资料下载
参数资料
| 型号： | STPCE1EEBC |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 外设及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PBGA388 |
| 封装： | PLASTIC, BGA-388 |
| 文件页数： | 76/87页 |
| 文件大小： | 1426K |
| 代理商： | STPCE1EEBC |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页当前第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页
Obsolete
Product(s)
- Obsolete
Product(s)
DESIGN GUIDELINES
78/87
Release 1.3 - January 29, 2002
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
When considering thermal dissipation, one of the
most
important
parts
of
the
layout
is
the
connection between the ground balls and the
ground layer.
A 1-wire connection is shown in Figure 6-25. The
use of a 8-mil wire results in a thermal resistance
of 105°C/W assuming copper is used (418 W/
m.°K). This high value is due to the thickness (34
m) of the copper on the external side of the PCB.
Considering only the central matrix of 36 thermal
balls and one via for each ball, the global thermal
resistance
is
2.9°C/W.
This
can
be
easily
improved using four 12.5 mil wires to connect to
the four vias around the ground pad link as in
Figure 6-26. This gives a total of 49 vias and a
global resistance for the 36 thermal balls of 0.5°C/
W.
The use of a ground plane like in Figure 6-27 is
even better.
Figure 6-25. Recommended 1-wire Power/Ground Pad Layout
Solder Mask (4 mil)
Pad for ground ball (diameter = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 12.5 mil)
Via (diameter = 24 mil)
34
.5
mi
l
1 mil = 0.0254 mm
Figure 6-26. Recommended 4-wire Ground Pad Layout
4 via pads for each ground ball
相关PDF资料 |
PDF描述 |
|---|---|
| STR631FV0T6 | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PQFP100 |
| STR636FV2T6 | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PQFP100 |
| STR630FZ2H6 | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PBGA144 |
| STR630FZ2T6 | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PQFP144 |
| STR710FR1T6 | 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PQFP64 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| STPCE1EEBI | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBC | 制造商:STMicroelectronics 功能描述:X86 GENERAL PURPOSE CONTROLLER - Bulk |
| STPCE1HDBI | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Microprocessor |
| STPCE1HEBC | 功能描述:微处理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。