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参数资料
| 型号： | STPCE1EEBC |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 外设及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PBGA388 |
| 封装： | PLASTIC, BGA-388 |
| 文件页数： | 77/87页 |
| 文件大小： | 1426K |
| 代理商： | STPCE1EEBC |
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DESIGN GUIDELINES
Release 1.3 - January 29, 2002
79/87
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
To avoid solder wicking over to the via pads during
soldering, it is important to have a solder mask of
4 mil around the pad (NSMD pad). This gives a
diameter of 33 mil for a 25 mil ground pad.
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no
local board distortion is tolerated.
6.4.4.3. Heat dissipation
The thickness of the copper on PCB layers is
typically 34 m for external layers and 17 m for
internal
layers.
This
means
that
thermal
dissipation is not good; high board temperatures
are concentrated around the devices and these
fall quickly with increased distance.
Where possible, place a metal layer inside the
PCB; this improves dramatically the spread of
heat and hence the thermal dissipation of the
board.
The possibility of using the whole system box for
thermal dissipation is very useful in cases of high
internal
temperatures
and
low
outside
temperatures. Bottom side of the PBGA should be
thermally connected to the metal chassis in order
to propagate the heat flow through the metal.
Thermally connecting also the top side will
improve furthermore the heat dissipation. Figure
6-28 illustrates such an implementation.
Figure 6-27. Optimum Layout for Central Ground Ball - top layer
Via to Ground layer
Pad for ground ball
Clearance = 6mil
diameter = 25 mil
hole diameter = 14 mil
Solder mask
diameter = 33 mil
External diameter = 37 mil
connections = 10 mil
Figure 6-28. Use of Metal Plate for Thermal Dissipation
Metal planes
Thermal conductor
Board
Die
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相关代理商/技术参数 |
参数描述 |
|---|---|
| STPCE1EEBI | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBC | 制造商:STMicroelectronics 功能描述:X86 GENERAL PURPOSE CONTROLLER - Bulk |
| STPCE1HDBI | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Microprocessor |
| STPCE1HEBC | 功能描述:微处理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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