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参数资料
| 型号： | W25Q16DWZPIP |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 16M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| 封装： | 6 X 5 MM, GREEN , PLASTIC, WSON-8 |
| 文件页数： | 36/83页 |
| 文件大小： | 1268K |
| 代理商： | W25Q16DWZPIP |
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W25Q16DW
Publication Release Date: April 01, 2011
- 41 -
Preliminary - Revision A
10.2.19 Set Burst with Wrap (77h)
In Standard SPI mode, the Set Burst with Wrap (77h) instruction is used in conjunction with “Fast Read
Quad I/O” and “Word Read Quad I/O” instructions to access a fixed length of 8/16/32/64-byte section
within a 256-byte page. Certain applications can benefit from this feature and improve the overall system
code execution performance.
Similar to a Quad I/O instruction, the Set Burst with Wrap instruction is initiated by driving the /CS pin low
and then shifting the instruction code “77h” followed by 24 dummy bits and 8 “Wrap Bits”, W7-0. The
instruction sequence is shown in Figure 18. Wrap bit W7 and the lower nibble W3-0 are not used.
W6, W5
W4 = 0
W4 =1 (DEFAULT)
Wrap Around
Wrap Length
Wrap Around
Wrap Length
0 0
Yes
8-byte
No
N/A
0 1
Yes
16-byte
No
N/A
1 0
Yes
32-byte
No
N/A
1 1
Yes
64-byte
No
N/A
Once W6-4 is set by a Set Burst with Wrap instruction, all the following “Fast Read Quad I/O” and “Word
Read Quad I/O” instructions will use the W6-4 setting to access the 8/16/32/64-byte section within any
page. To exit the “Wrap Around” function and return to normal read operation, another Set Burst with
Wrap instruction should be issued to set W4 = 1. The default value of W4 upon power on is 1. In the case
of a system Reset while W4 = 0, it is recommended that the controller issues a Set Burst with Wrap
instruction to reset W4 = 1 prior to any normal Read instructions since W25Q16DW does not have a
hardware Reset Pin.
In QPI mode, the “Burst Read with Wrap (0Ch)” instruction should be used to perform the Read operation
with “Wrap Around” feature. The Wrap Length set by W5-4 in Standard SPI mode is still valid in QPI mode
and can also be re-configured by “Set Read Parameters (C0h)” instruction. Refer to 10.2.38 and 10.2.39
for details.
Wrap Bit
/CS
CLK
Mode 0
Mode 3
0
1
IO
0
IO
1
IO
2
IO
3
2
3
4
5
X
don't
care
6
7
8
9
don't
care
don't
care
10
11
12
13
14
15
Instruction (77h)
Mode 0
Mode 3
X
w4
X
w5
X
w6
X
Figure 18. Set Burst with Wrap Instruction (SPI Mode only)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q16V | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16VSFIG | 功能描述:IC FLASH 16MBIT 80MHZ 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步，DDR II 存储容量:18M（1M x 18） 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA（13x15） 包装:托盘 其它名称:71P71804S200BQ |
| W25Q16VSSIG | 功能描述:IC FLASH 16MBIT 80MHZ 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步，DDR II 存储容量:18M（1M x 18） 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA（13x15） 包装:托盘 其它名称:71P71804S200BQ |
| W25Q16VZPIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q20BW | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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