参数资料
型号: XC3S1400A-4FT256I
厂商: Xilinx Inc
文件页数: 44/132页
文件大小: 0K
描述: IC FPGA SPARTAN 3 256FTBGA
标准包装: 90
系列: Spartan®-3A
LAB/CLB数: 2816
逻辑元件/单元数: 25344
RAM 位总计: 589824
输入/输出数: 161
门数: 1400000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
DC and Switching Characteristics
DS529-3 (v2.0) August 19, 2010
19
Differential Output Pairs
Figure 5: Differential Output Voltages
Table 14: DC Characteristics of User I/Os Using Differential Signal Standards
IOSTANDARD Attribute
VOD
VOCM
VOH
VOL
Min (mV)
Typ
(mV)
Max (mV)
Min (V)
Typ (V)
Max (V)
Min (V)
Max (V)
LVDS_25
247
350
454
1.125
–1.375
LVDS_33
247
350
454
1.125
–1.375
BLVDS_25
240
350
460
–1.30
MINI_LVDS_25
300
600
1.0
–1.4
MINI_LVDS_33
300
600
1.0
–1.4
RSDS_25
100
400
1.0
–1.4
RSDS_33
100
400
1.0
–1.4
TMDS_33
400
–800
VCCO – 0.405
–VCCO – 0.190
PPDS_25
100
400
0.5
0.8
1.4
PPDS_33
100
400
0.5
0.8
1.4
DIFF_HSTL_I_18
–VCCO – 0.4
0.4
DIFF_HSTL_II_18
–VCCO – 0.4
0.4
DIFF_HSTL_III_18
–VCCO – 0.4
0.4
DIFF_HSTL_I
VCCO – 0.4
0.4
DIFF_HSTL_III
VCCO – 0.4
0.4
DIFF_SSTL18_I
–VTT + 0.475
VTT – 0.475
DIFF_SSTL18_II
–VTT + 0.603
VTT – 0.603
DIFF_SSTL2_I
–VTT + 0.61
VTT – 0.61
DIFF_SSTL2_II
–VTT + 0.81
VTT – 0.81
DIFF_SSTL3_I
–VTT + 0.6
VTT – 0.6
DIFF_SSTL3_II
–VTT + 0.8
VTT – 0.8
Notes:
1.
The numbers in this table are based on the conditions set forth in Table 8 and Table 13.
2.
3.
Output voltage measurements for all differential standards are made with a termination resistor (RT) of 100Ω across the N and P pins of the
differential signal pair.
4.
At any given time, no more than two of the following differential output standards can be assigned to an I/O bank: LVDS_25, RSDS_25,
MINI_LVDS_25, PPDS_25 when VCCO=2.5V, or LVDS_33, RSDS_33, MINI_LVDS_33, TMDS_33, PPDS_33 when VCCO = 3.3V
V
OUTN
V
OUTP
GND level
50%
V
OCM
V
OCM
V
OD
V
OL
V
OH
V
OUTP
Internal
Logic
V
OUTN
N
P
= Output common mode voltage =
2
V
OUTP +VOUTN
V
OD = Output differential voltage =
V
OH = Output voltage indicating a High logic level
V
OL
= Output voltage indicating a Low logic level
V
OUTP -VOUTN
Differential
I/O Pair Pins
DS529-3_11_012907
相关PDF资料
PDF描述
XC3S1400A-5FGG676C IC SPARTAN-3A FPGA 1400K 676FBGA
XC3S1400AN-4FGG676I IC FPGA SPARTAN-AN 1400K 676FBGA
XC3S1600E-5FGG484C IC FPGA SPARTAN-3E 1600K 484FBGA
XC3S400AN-4FG400I IC FPGA SPARTAN 3AN 400FBGA
XC3SD1800A-4CSG484LI IC FPGA SPARTAN 3 DSP 484CSGBGA
相关代理商/技术参数
参数描述
XC3S1400A-4FTG256C 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-4FTG256I 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FG484C 功能描述:IC SPARTAN-3A FPGA 1400K 484FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FG676C 功能描述:IC SPARTAN-3A FPGA 1400K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FGG484C 功能描述:IC SPARTAN-3A FPGA 1400K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)