参数资料
型号: XC3S1400A-4FT256I
厂商: Xilinx Inc
文件页数: 77/132页
文件大小: 0K
描述: IC FPGA SPARTAN 3 256FTBGA
标准包装: 90
系列: Spartan®-3A
LAB/CLB数: 2816
逻辑元件/单元数: 25344
RAM 位总计: 589824
输入/输出数: 161
门数: 1400000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
DC and Switching Characteristics
DS529-3 (v2.0) August 19, 2010
49
Digital Frequency Synthesizer (DFS)
Table 38: Recommended Operating Conditions for the DFS
Symbol
Description
Speed Grade
Units
-5
-4
Min
Max
Min
Max
Input Frequency Ranges(2)
FCLKIN
CLKIN_FREQ_FX
Frequency for the CLKIN input
0.200
333(4)
0.200
333(4)
MHz
Input Clock Jitter Tolerance(3)
CLKIN_CYC_JITT_FX_LF
Cycle-to-cycle jitter at the CLKIN
input, based on CLKFX output
frequency
FCLKFX < 150 MHz
±300
±300
ps
CLKIN_CYC_JITT_FX_HF
FCLKFX > 150 MHz
±150
±150
ps
CLKIN_PER_JITT_FX
Period jitter at the CLKIN input
±1
±1
ns
Notes:
1.
DFS specifications apply when either of the DFS outputs (CLKFX or CLKFX180) are used.
2.
If both DFS and DLL outputs are used on the same DCM, follow the more restrictive CLKIN_FREQ_DLL specifications in Table 36.
3.
CLKIN input jitter beyond these limits may cause the DCM to lose lock.
4.
To support double the maximum effective FCLKIN limit, set the CLKIN_DIVIDE_BY_2 attribute to TRUE. This attribute divides the incoming
clock frequency by two as it enters the DCM.
Table 39: Switching Characteristics for the DFS
Symbol
Description
Device
Speed Grade
Units
-5
-4
Min
Max
Min
Max
Output Frequency Ranges
CLKOUT_FREQ_FX(2)
Frequency for the CLKFX and CLKFX180 outputs
All
5
350
5
320
MHz
Output Clock Jitter(3,4)
CLKOUT_PER_JITT_FX
Period jitter at the CLKFX and CLKFX180
outputs.
All
Typ
Max
Typ
Max
CLKIN
20 MHz
Use the Spartan-3A Jitter Calculator:
ps
CLKIN
> 20 MHz
±[1% of
CLKFX
period
+ 100]
±[1% of
CLKFX
period
+ 200]
±[1% of
CLKFX
period
+ 100]
±[1% of
CLKFX
period
+ 200]
ps
Duty Cycle(5,6)
CLKOUT_DUTY_CYCLE_FX
Duty cycle precision for the CLKFX and CLKFX180 outputs,
including the BUFGMUX and clock tree duty-cycle distortion
All
±[1% of
CLKFX
period
+ 350]
±[1% of
CLKFX
period
+ 350]
ps
Phase Alignment(6)
CLKOUT_PHASE_FX
Phase offset between the DFS CLKFX output and the DLL
CLK0 output when both the DFS and DLL are used
All
±200
±200
ps
CLKOUT_PHASE_FX180
Phase offset between the DFS CLKFX180 output and the DLL
CLK0 output when both the DFS and DLL are used
All
±[1% of
CLKFX
period
+ 200]
±[1% of
CLKFX
period
+ 200]
ps
相关PDF资料
PDF描述
XC3S1400A-5FGG676C IC SPARTAN-3A FPGA 1400K 676FBGA
XC3S1400AN-4FGG676I IC FPGA SPARTAN-AN 1400K 676FBGA
XC3S1600E-5FGG484C IC FPGA SPARTAN-3E 1600K 484FBGA
XC3S400AN-4FG400I IC FPGA SPARTAN 3AN 400FBGA
XC3SD1800A-4CSG484LI IC FPGA SPARTAN 3 DSP 484CSGBGA
相关代理商/技术参数
参数描述
XC3S1400A-4FTG256C 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-4FTG256I 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FG484C 功能描述:IC SPARTAN-3A FPGA 1400K 484FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FG676C 功能描述:IC SPARTAN-3A FPGA 1400K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FGG484C 功能描述:IC SPARTAN-3A FPGA 1400K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)