参数资料
型号: XC3S1400A-4FT256I
厂商: Xilinx Inc
文件页数: 48/132页
文件大小: 0K
描述: IC FPGA SPARTAN 3 256FTBGA
标准包装: 90
系列: Spartan®-3A
LAB/CLB数: 2816
逻辑元件/单元数: 25344
RAM 位总计: 589824
输入/输出数: 161
门数: 1400000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
DC and Switching Characteristics
22
DS529-3 (v2.0) August 19, 2010
I/O Timing
Pin-to-Pin Clock-to-Output Times
Table 18: Pin-to-Pin Clock-to-Output Times for the IOB Output Path
Symbol
Description
Conditions
Device
Speed Grade
Units
-5
-4
Max
Clock-to-Output Times
TICKOFDCM
When reading from the Output
Flip-Flop (OFF), the time from the
active transition on the Global
Clock pin to data appearing at the
Output pin. The DCM is in use.
LVCMOS25(2), 12mA
output drive, Fast slew
rate, with DCM(3)
XC3S50A
3.18
3.42
ns
XC3S200A
3.21
3.27
ns
XC3S400A
2.97
3.33
ns
XC3S700A
3.39
3.50
ns
XC3S1400A
3.51
3.99
ns
TICKOF
When reading from OFF, the time
from the active transition on the
Global Clock pin to data appearing
at the Output pin. The DCM is not
in use.
LVCMOS25(2), 12mA
output drive, Fast slew
rate, without DCM
XC3S50A
4.59
5.02
ns
XC3S200A
4.88
5.24
ns
XC3S400A
4.68
5.12
ns
XC3S700A
4.97
5.34
ns
XC3S1400A
5.06
5.69
ns
Notes:
1.
The numbers in this table are tested using the methodology presented in Table 27 and are based on the operating conditions set forth in
2.
This clock-to-output time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or a
standard other than LVCMOS25 with 12 mA drive and Fast slew rate is assigned to the data Output. If the former is true, add the appropriate
Input adjustment from Table 23. If the latter is true, add the appropriate Output adjustment from Table 26.
3.
DCM output jitter is included in all measurements.
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