参数资料
型号: XC3S1400A-4FT256I
厂商: Xilinx Inc
文件页数: 88/132页
文件大小: 0K
描述: IC FPGA SPARTAN 3 256FTBGA
标准包装: 90
系列: Spartan®-3A
LAB/CLB数: 2816
逻辑元件/单元数: 25344
RAM 位总计: 589824
输入/输出数: 161
门数: 1400000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
DC and Switching Characteristics
DS529-3 (v2.0) August 19, 2010
59
Serial Peripheral Interface (SPI) Configuration Timing
Figure 14: Waveforms for Serial Peripheral Interface (SPI) Configuration
Table 52: Timing for Serial Peripheral Interface (SPI) Configuration Mode
Symbol
Description
Minimum
Maximum
Units
TCCLK1
Initial CCLK clock period
TCCLKn
CCLK clock period after FPGA loads ConfigRate bitstream option setting
TMINIT
Setup time on VS[2:0] variant-select pins and M[2:0] mode pins before the
rising edge of INIT_B
50
–ns
TINITM
Hold time on VS[2:0] variant-select pins and M[2:0] mode pins after the
rising edge of INIT_B
0
–ns
TCCO
MOSI output valid delay after CCLK falling clock edge
TDCC
Setup time on the DIN data input before CCLK rising clock edge
TCCD
Hold time on the DIN data input after CCLK rising clock edge
T
DH
T
DSU
Command
(msb)
T
V
T
CSS
<1:1:1>
INIT_B
M[2:0]
T
MINIT
T
INITM
DIN
CCLK
(Input)
T
CCLK
n
T
CCLK1
VS[2:0]
(Input)
New ConfigRate active
Mode input pins M[2:0] and variant select input pins VS[2:0] are sampled when INIT_B
goes High. After this point, input values do not matter until DONE goes High, at which
point these pins become user-I/O pins.
<0:0:1>
Pin initially pulled High by internal pull-up resistor if PUDC_B input is Low.
Pin initially high-impedance (Hi-Z) if PUDC_B input is High. External pull-up resistor required on CSO_B.
T
CCLK1
T
MCCL
n
T
MCCH
n
(Input)
Data
CSO_B
MOSI
T
CCO
T
MCCL1
T
MCCH1
T
DCC
T
CCD
(Input)
PROG_B
PUDC_B
(Input)
PUDC_B must be stable before INIT_B goes High and constant throughout the configuration process.
DS529-3_06_102506
(Open-Drain)
Shaded values indicate specifications on attached SPI Flash PROM.
Command
(msb-1)
相关PDF资料
PDF描述
XC3S1400A-5FGG676C IC SPARTAN-3A FPGA 1400K 676FBGA
XC3S1400AN-4FGG676I IC FPGA SPARTAN-AN 1400K 676FBGA
XC3S1600E-5FGG484C IC FPGA SPARTAN-3E 1600K 484FBGA
XC3S400AN-4FG400I IC FPGA SPARTAN 3AN 400FBGA
XC3SD1800A-4CSG484LI IC FPGA SPARTAN 3 DSP 484CSGBGA
相关代理商/技术参数
参数描述
XC3S1400A-4FTG256C 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-4FTG256I 功能描述:IC FPGA SPARTAN3A 1400K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FG484C 功能描述:IC SPARTAN-3A FPGA 1400K 484FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FG676C 功能描述:IC SPARTAN-3A FPGA 1400K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S1400A-5FGG484C 功能描述:IC SPARTAN-3A FPGA 1400K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)