参数资料
型号: XCF128XFTG64C
厂商: Xilinx Inc
文件页数: 53/88页
文件大小: 0K
描述: IC PROM SRL 128M GATE 64-FTBGA
标准包装: 1
可编程类型: 系统内可编程
存储容量: 128Mb
电源电压: 1.7 V ~ 2 V
工作温度: -40°C ~ 85°C
封装/外壳: 64-TBGA
供应商设备封装: 64-TFBGA
包装: 托盘
产品目录页面: 601 (CN2011-ZH PDF)
其它名称: 122-1578
Platform Flash XL High-Density Configuration and Storage Device
DS617 (v3.0.1) January 07, 2010
Product Specification
57
R
Table 32: Reset and Power-Up AC Characteristics
Symbol
Parameter
Test Condition
Min
Unit
TPLWL
TPLEL
TPLGL
TPLLL
Reset Low to:
Write Enable Low,
Chip Enable Low,
Output Enable Low,
Latch Enable Low
During Program
60
μs
During Erase
60
μs
Other Conditions
60
μs
TPHWL
TPHEL
TPHGL
TPHLL
Reset High to:
Write Enable Low
Chip Enable Low
Output Enable Low
Latch Enable Low
–60
μs
TPLPH(1),(2)
RP Pulse Width
50
ns
TVDHPH
Supply Voltages High to Reset High
0
μs
Notes:
1.
A device reset is possible but not guaranteed if TPLPH < 50 ns.
2.
Sampled only, not 100% tested.
X-Ref Target - Figure 34
Notes:
1.
READY_WAIT requires an external pull-up resistor to VDDQ sufficiently strong to ensure a clean Low-to-High transition within less than TRWRT
when the READY_WAIT pin is released to a high-impedance state.
Figure 34: READY_WAIT AC Waveform
High
W, G, L
Low
E
VDD, VDDQ
RP
READY_WAIT
T
VDHPT
T
RWRT
T
PLPH
T
PLRWL
T
RWL
T
RWRT
T
RWLRWH
T
RWRT
Power-Up
Reset
READY_WAIT
(pulse)
DS617_29_090108
T
PHRWZ
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